Accessories

Image Part Number Description / PDF Quantity Rfq
PTC-04-DB-81106

PTC-04-DB-81106

Melexis

PTC04 DAUGHTERBOARD 81106

19

PTC04_SENSORS_MULTI_CALIBRATION_BOARD

PTC04_SENSORS_MULTI_CALIBRATION_BOARD

Melexis

PTC04 EXTENSION BOARD

0

MLX LIN MASTER

MLX LIN MASTER

Melexis

LIN MASTER FOR BUS-PC USB CONN

0

PTC-04-DB-DEBUG

PTC-04-DB-DEBUG

Melexis

PTC04 DAUGHTERBOARD DEBUG

0

PTC-04-DB-80104

PTC-04-DB-80104

Melexis

PTC04 DAUGHTERBOARD 80104

0

PTC-04-DB-HALL01

PTC-04-DB-HALL01

Melexis

PTC04 DAUGHTERBOARD HALL01

3

PTC-TESTBENCH-MLX90316

PTC-TESTBENCH-MLX90316

Melexis

PTC04 TESTBENCH MLX90316

0

PTC-04-DB-90316

PTC-04-DB-90316

Melexis

PTC04 DAUGHTERBOARD 90316

0

PTC-04-DB-FL

PTC-04-DB-FL

Melexis

PTC04 DAUGHTERBOARD FL

0

PTC-TESTBENCH-MAGNETIC

PTC-TESTBENCH-MAGNETIC

Melexis

PTC04 TESTBENCH MAGNETIC

0

PTC-04-DB-SPI01

PTC-04-DB-SPI01

Melexis

PTC04 DAUGHTERBOARD SPI01

0

PTC04_DB_PRESSURE01

PTC04_DB_PRESSURE01

Melexis

PTC04 DAUGHTERBOARD PRESSURE01

6

PTC04-DB-922XX

PTC04-DB-922XX

Melexis

PTC04 DAUGHTERBOARD 922XX

2

CABLE PTC04-A3

CABLE PTC04-A3

Melexis

PTC-04 INTERCONNECTING CABLE

8

MLX80104 TESTINTERFACE

MLX80104 TESTINTERFACE

Melexis

INTERFACE BOARD MINIE-MLX & APPL

1

PTC-04-DB-HALL02

PTC-04-DB-HALL02

Melexis

PTC04 DAUGHTERBOARD HALL02

2

PTC04-DB-MUPET

PTC04-DB-MUPET

Melexis

PTC04 DAUGHTERBOARD MUPET

0

PTC-04-DB-HALL06

PTC-04-DB-HALL06

Melexis

PTC04 DAUGHTERBOARD HALL06

0

PTC04-DB-8X91804

PTC04-DB-8X91804

Melexis

PTC04 DAUGHTERBOARD 91804

4

PTC-04-DB-HALL03

PTC-04-DB-HALL03

Melexis

PTC04 DAUGHTERBOARD HALL03

2

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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