Accessories

Image Part Number Description / PDF Quantity Rfq
DS9120Q+

DS9120Q+

Maxim Integrated

TDFN SOCKET BOARDS FOR EVALUATIN

10

MAXPOWERTOOL001#

MAXPOWERTOOL001#

Maxim Integrated

DONGLE TO BE USED WITH MAX15301

8

SC-USB-SPI-PICO

SC-USB-SPI-PICO

Maxim Integrated

USB-TO-SPI INTERFACE ADAPTER

21

DS91230+

DS91230+

Maxim Integrated

DS91230 CONNECTOR USB ADAPTER

0

DS3900P2EVKIT#

DS3900P2EVKIT#

Maxim Integrated

EVAL KIT DS3900P2

27

MAXAUDINT001#

MAXAUDINT001#

Maxim Integrated

AUDIO INTERFACE BOARD, PROVIDING

44

MAXCOAX2STP-HSD#

MAXCOAX2STP-HSD#

Maxim Integrated

EVAL KIT FOR MAXCOAX

45

DS9490R

DS9490R

Maxim Integrated

IC BRIDGE USB TO 1-WIRE RJ11

0

DS9097E#

DS9097E#

Maxim Integrated

COM PORT ADAPTER

0

DS9490B

DS9490B

Maxim Integrated

IC IBTN HOLDER USB SGL F5 W/CAP

0

MAXQUSBJTAG-KIT#

MAXQUSBJTAG-KIT#

Maxim Integrated

MAXQ USB JTAG EVAL BOARD

0

MAXSPCSPARTAN6+

MAXSPCSPARTAN6+

Maxim Integrated

ADC AND DAC EVAL EXPANSION BOARD

0

DS3900K#

DS3900K#

Maxim Integrated

EVAL KIT (2-WIRE BUS INTERFACE )

0

MAXSMBUS

MAXSMBUS

Maxim Integrated

EVAL KIT MAXSMBUS (TWO-WIRE INTE

0

DS9000/NO-BRAND

DS9000/NO-BRAND

Maxim Integrated

HARNESS CBL DS1217 TO 28DIP SCKT

0

DS9002/NO-BRAND

DS9002/NO-BRAND

Maxim Integrated

HOUSING CARTRIDGE PLASTIC 2PC

0

DS9120G+

DS9120G+

Maxim Integrated

EVALUATION KIT

0

USBTO232+

USBTO232+

Maxim Integrated

EVAL KIT USBTO232 (USB-TO-COM PO

0

INTF60X#

INTF60X#

Maxim Integrated

INTERFACE BOARD FOR MAX2173EVKIT

0

CMODUSB

CMODUSB

Maxim Integrated

EVALUATION BOARD USB

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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