Accessories

Part Number	Description / PDF	Quantity
CY3250-29XXXQFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C29 QFN	0
CY3250-20434QFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C20434 QFN	0
CY3250-24X23A-POD IR (Infineon Technologies)	EVAL KITS/TOOLS	0
CY3096 IR (Infineon Technologies)	SOCKET ADAPTER FOR CY2071AF	0
KITXMC4XMOTGPDLV001TOBO1 IR (Infineon Technologies)	KIT MOTOR DRIVE FOR XMC4500	2
KIT2K5WCCMTOLLTOBO1 IR (Infineon Technologies)	TO LEADLESS ADAPTER	3
KIT6W12VP7950VTOBO1 IR (Infineon Technologies)	EVAL BOARD FOR ICE5QSAG	189
KIT_XMC4X_UNI_EXT01_001 IR (Infineon Technologies)	KIT EXTENSION FOR XMC4500	5
CY3250-21X34QFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C21X34 QFN	0
CY3250-24X94QFN IR (Infineon Technologies)	EVAL KITS/TOOLS	0
CY3250-20334QFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C20334 QFN	0
CY3250-24X23AQFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C24X23 QFN	0
KITLGDBBOM003TOBO1 IR (Infineon Technologies)	EVALUATION DAUGHTER BOARD	17
UIOSTICKTOBO1 IR (Infineon Technologies)	UIO-STICK CONTROL BOARDS/KITS	36
CY3210-28XXX IR (Infineon Technologies)	APPLICATION PROCESSOR AND SOC	0
CY3250-68QFN-FK IR (Infineon Technologies)	REPLACEMENT ICE PODS (4) 28-SSOP	5
CY3250-27XXXQFN-POD IR (Infineon Technologies)	EVAL KITS/TOOLS	0
CY3250-21X34QFN IR (Infineon Technologies)	EVAL KITS/TOOLS	0
KIT_XMC4X_HMI_OLED_001 IR (Infineon Technologies)	KIT INTERFACE FOR XMC4500	1
KIT_XMC4X_AUT_ISO_001 IR (Infineon Technologies)	KIT AUTOMATION FOR XMC4500	3

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization