Accessories

Image Part Number Description / PDF Quantity Rfq
ADA-ETM-JTAG

ADA-ETM-JTAG

IAR Systems Software Inc

PROBE TRACE MODULE JTAG/EMBEDDED

0

ADA-ISO-TI14

ADA-ISO-TI14

IAR Systems Software Inc

JTAG ISOLATION ADAPTER C2000

0

ADA-JET-TI14

ADA-JET-TI14

IAR Systems Software Inc

JTAG PROBE TI DSP 14PIN STD VOLT

0

CAB-JTAG

CAB-JTAG

IAR Systems Software Inc

REPLACEMENT CABLE FOR JTAGJET

0

ADA-JET-ARM20-LV

ADA-JET-ARM20-LV

IAR Systems Software Inc

JTAG PROBE ARM20 LOW VOLTAGE

0

ADA-JET-ARM20

ADA-JET-ARM20

IAR Systems Software Inc

JTAG PROBE ARM20 STANDARD VOLT

0

ADA-JET-TI14-LV

ADA-JET-TI14-LV

IAR Systems Software Inc

JTAG PROBE TI DSP 14PIN LOW VOLT

0

ADA-JET-CTI20

ADA-JET-CTI20

IAR Systems Software Inc

JTAG PROBE COMPACT TI 20PIN

0

ADA-JET-ARM14

ADA-JET-ARM14

IAR Systems Software Inc

PROBE FOR ADA-JET-ARM20/20-LV

0

CAB-ETM

CAB-ETM

IAR Systems Software Inc

CABLE FOR ETM-38 HEADERS

0

ADA-ETM-SWD20

ADA-ETM-SWD20

IAR Systems Software Inc

PROBE PASSIVE 20PIN CORTEX

0

DONGLE

DONGLE

IAR Systems Software Inc

IAR USB DONGLE KEY

0

ADA-ARM20-SWD

ADA-ARM20-SWD

IAR Systems Software Inc

PROBE PASSIVE 10PIN/20PIN CORTEX

0

ADA-ISO-TI14E

ADA-ISO-TI14E

IAR Systems Software Inc

JTAG ISOLATION ADAPTER C2000

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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