Accessories

Image Part Number Description / PDF Quantity Rfq
XR77XXEVB-XCM-V80

XR77XXEVB-XCM-V80

MaxLinear

EXAR CONFIGURATION MODULE POWER

0

XR77XXEVB-XCM-V62

XR77XXEVB-XCM-V62

MaxLinear

EXAR CONFIGURATION MODULE POWER

0

XR77EVB-INT-1

XR77EVB-INT-1

MaxLinear

INTERFACE BOARD PROGRAMMABLE POW

0

CAB-DB15-V4A4S0

CAB-DB15-V4A4S0

MaxLinear

CABLE SHIELD ON SHELL

0

XRP77XXEVB-XCM

XRP77XXEVB-XCM

MaxLinear

EVAL BOARD W/USB-I2C FOR XRP7704

0

392-10107

392-10107

MaxLinear

BRACKETS

0

CAB-00010-001

CAB-00010-001

MaxLinear

CAB-00010-001

0

C30244X-B4

C30244X-B4

MaxLinear

C30244X-B4

0

392-10064

392-10064

MaxLinear

BRACKETS

0

392-10069

392-10069

MaxLinear

BRACKETS

0

CAB-00001-001

CAB-00001-001

MaxLinear

CAB-00001-001

0

410-10022-3A

410-10022-3A

MaxLinear

410-10022-3A

0

392-10020

392-10020

MaxLinear

BRACKETS

0

392-10087

392-10087

MaxLinear

BRACKETS

0

392-10106

392-10106

MaxLinear

BRACKETS

0

650P11

650P11

MaxLinear

650P11

0

CAB-00002-002

CAB-00002-002

MaxLinear

CAB-00002-002

0

392-10009

392-10009

MaxLinear

BRACKETS

0

392-10061

392-10061

MaxLinear

BRACKETS

0

392-10065

392-10065

MaxLinear

BRACKETS

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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