Accessories

Image Part Number Description / PDF Quantity Rfq
EA-QSB-100

EA-QSB-100

Embedded Artists

BOARD QUICK START

0

EA-ACC-027

EA-ACC-027

Embedded Artists

LABTOOL CABLE 26-POS

0

EA-ACC-026

EA-ACC-026

Embedded Artists

RIBBON CABLE IDC 24-POS 50MIL

0

EA-XPR-301

EA-XPR-301

Embedded Artists

KIT EXPERIMENT LPC812 MAX

0

EA-QSB-017

EA-QSB-017

Embedded Artists

BOARD QSB BASE LPC4088

0

EA-EDU-011

EA-EDU-011

Embedded Artists

EXPANSION BOARD EXPERIMENT

0

EAD00265

EAD00265

Embedded Artists

COM DISPLAY ADAPTER

0

EA-ACC-040

EA-ACC-040

Embedded Artists

JTAG ADAPTER 10-PIN TO 20-PIN

0

EA-QSB-018

EA-QSB-018

Embedded Artists

BASE BOARD EXPERIMENT LPC4088

0

EA-LCD-008

EA-LCD-008

Embedded Artists

LCD 1.5" RGB 128X128 PX

0

EA-XPR-020

EA-XPR-020

Embedded Artists

BOARD PROTOTYPE LPCXPRESSO

0

EA-LCD-007

EA-LCD-007

Embedded Artists

LCD 1.35" MEMORY 96X96 PX

0

EA-LCD-005

EA-LCD-005

Embedded Artists

KIT ADAPTER QVGA DISPLAY

0

EA-LCD-105

EA-LCD-105

Embedded Artists

QVGA DISPLAY ADAPTER KIT

0

EA-XPR-110

EA-XPR-110

Embedded Artists

KIT LPCXPRESSO VALUE PACK

0

EA-XPR-202

EA-XPR-202

Embedded Artists

LAB TOOL LPCXPRESSO W/LPC-LINK 2

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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