Accessories

Image Part Number Description / PDF Quantity Rfq
X-INN-02-0008

X-INN-02-0008

Advantech

SECUREBOOT LEVEL 1

0

X-INN-12-1305

X-INN-12-1305

Advantech

50 PIN EDGE CONNECTOR

0

X-INN-60-1196-00

X-INN-60-1196-00

Advantech

6760/1GB 2XDVI MDP W/ HEATPIPE

0

X-INN-80-1735-00

X-INN-80-1735-00

Advantech

DPX-E SERIES INLINE CONNECTER BO

0

X-INN-60-1193-00

X-INN-60-1193-00

Advantech

6760/1GB 2XDVI MDP W/ FANSINK

0

X-INN-80-1736-00

X-INN-80-1736-00

Advantech

DPX-E-SERIES CONNECTER BOARD WIT

0

X-INN-60-1195-00

X-INN-60-1195-00

Advantech

6460/512MB 4XMDP W/HEATPIPE

0

X-INN-12-1357-00

X-INN-12-1357-00

Advantech

50 PIN EDGE CONNECTOR

0

X-INN-60-1198-00

X-INN-60-1198-00

Advantech

6760/1GB 6X MDP WITH HEATPIPE

0

X-INN-17-1141-00

X-INN-17-1141-00

Advantech

PSU-270W ALL MODELS

0

IPS-M420A-LFA-SE

IPS-M420A-LFA-SE

Advantech

420WH BATTERY

0

X-INN-17-1133

X-INN-17-1133

Advantech

PSU - 180W ATX

0

X-INN-60-1194-00

X-INN-60-1194-00

Advantech

6460/512MB 2XDVI 1X MDP HEATPIP

0

X-INN-60-1197-00

X-INN-60-1197-00

Advantech

6760/1GB 6X MDP WITH COOLER

0

X-INN-12-1359-00

X-INN-12-1359-00

Advantech

50 PIN INLINE EDGE CONNECTOR

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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