Accessories

Image Part Number Description / PDF Quantity Rfq
CONFIG MODULE 0107

CONFIG MODULE 0107

Broadcom

CONFIGURATION MODULE 0107

0

X1 PCI EXPRESS CABLE

X1 PCI EXPRESS CABLE

Broadcom

1 METER PCIE X1 CABLE

0

CONFIG MODULE 0108

CONFIG MODULE 0108

Broadcom

CONFIGURATION MODULE 0108

0

L5-25147-00

L5-25147-00

Broadcom

LSI00272 - ACTIVE CABLE 20M

0

L5-25229-01

L5-25229-01

Broadcom

SAS6160 HALF-W PUMA SWITCH KIT

0

CONFIG MODULE 0145

CONFIG MODULE 0145

Broadcom

CONFIG MODULE 0145

0

L5-25156-01

L5-25156-01

Broadcom

SAS6160 HALF-W PUMA SHELF KIT

0

L5-25230-00

L5-25230-00

Broadcom

SAS6160 HLF W PUMA POWER SUPPLY

0

L3-25111-00

L3-25111-00

Broadcom

BLACKJACK INTERPOSER

0

124NLVTSCSXX

124NLVTSCSXX

Broadcom

APD 2.5G COC

0

CONFIG MODULE 0110

CONFIG MODULE 0110

Broadcom

CONFIGURATION MODULE 0110

0

L5-25146-00

L5-25146-00

Broadcom

LSI00273 - ACTIVE CABLE 10M

0

CONFIG MODULE 0111

CONFIG MODULE 0111

Broadcom

CONFIGURATION MODULE 0111

0

CONFIG MODULE 0144

CONFIG MODULE 0144

Broadcom

CONFIG MODULE 0144

0

124NLVTSI

124NLVTSI

Broadcom

APD 2.5G DIE

0

CONFIG MODULE 0142

CONFIG MODULE 0142

Broadcom

CONFIG MODULE 0142

0

L3-25183-00

L3-25183-00

Broadcom

BLACKJACK INTERPOSER

0

CONFIG MODULE 0143

CONFIG MODULE 0143

Broadcom

CONFIG MODULE 0143

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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