Accessories

Image Part Number Description / PDF Quantity Rfq
CVM50XM

CVM50XM

TechTools

MEMBER MOD PIC12C508/PIC12C509

0

CVM55XM

CVM55XM

TechTools

MEMBER MODULE PIC16C554/556/558

2

CVM77XM

CVM77XM

TechTools

MEMBER MODULE PIC16C773/774

3

CVM66XM

CVM66XM

TechTools

MEMBER MOD PIC16C641/642/661/662

0

CVM77M

CVM77M

TechTools

MEMBER MODULE PIC16C66/67/76/77

0

CVM5XXM

CVM5XXM

TechTools

MEMBR MOD PIC12C50X/CE51X/16C505

0

CVMT1

CVMT1

TechTools

EXECUTION TIMING MODULE MATHIAS

0

CVM871M

CVM871M

TechTools

MEMBER MODULE PIC16F870/F871

1

CVM711M

CVM711M

TechTools

MEMBER MODULE PIC16C71

0

CVM61M

CVM61M

TechTools

MEMBER MODULE PIC16C61

0

CVM5XF

CVM5XF

TechTools

FAMILY MODULE PIC16C5X

0

CVM5XM

CVM5XM

TechTools

MEMBER MODULE PIC16C5X

0

CVM67XM

CVM67XM

TechTools

MEMBER MODULE PIC12C671/672

1

CVMF77M

CVMF77M

TechTools

MEMBER MOD PIC16F73/F74/F76/F77

0

CVM001M

CVM001M

TechTools

MEMBER MOD PIC16C55X/62X/CE62X

0

CVM62XM

CVM62XM

TechTools

MEMBER MODULE PIC16C62X

0

CVMT2

CVMT2

TechTools

TRACE BUFFER MODULE MATHIAS

0

CVM7XM

CVM7XM

TechTools

MEMBER MODULE PIC16C62-65/72-74

2

CBL-ICSP

CBL-ICSP

TechTools

CABLE PROG QUICKWRITER SERIAL

0

C28D-6

C28D-6

TechTools

6" TARGET CABLE IDC TO 28PIN DIP

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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