Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	ST7FLITU0-D/RAIS STMicroelectronics	BOARD DAUGHTER STNDAL ST7FLITEU0	0
	ST7FOXK2-D/RAIS STMicroelectronics	BOARD DAUGHTER STANDALN ST7FOXK2	0
	ST7MDT20-TEB/DVP STMicroelectronics	BOARD TARGET EMULATION ST7-DVP	0
	ST72321B-D/RAIS STMicroelectronics	BOARD DAUGHTER WITH ST72321	0
	ST7MDT10-8/DVP STMicroelectronics	ADAPTER KIT FOR DVP3	0
	ST7MDT20-T64/DVP STMicroelectronics	KIT CONNECTOR FOR STMDT20 64TQFP	0
	ST7FOXA0-D/RAIS STMicroelectronics	BOARD DAUGHTER STANDALON STFOXA0	0
	ST7MDT20J-TEB STMicroelectronics	BOARD EMULATOR ST7-EMU3	0
	ST7MDT10-16/DVP STMicroelectronics	KIT DIP16/SO16 CONNECTION ST7	0
	ST7FLI49-D/RAIS STMicroelectronics	BOARD DAUGHTER 32LQFP ST7FLITE4	0
	ST7MDT20-T6A/DVP STMicroelectronics	KIT CONNECTION ST7MDT20-DVP3	0
	ST7MDT10-32/DVP STMicroelectronics	KIT DIP32/SO32 CONNECTION ST7	0
	ST7SB40-QP48/US STMicroelectronics	BOARD PROGRAMMING SOCKET ST7	0
	ST7MDT10-20/DVP STMicroelectronics	KIT DIP20/SO20 CONNECTION ST7	0
	ST7FLI49M-D/RAIS STMicroelectronics	BOARD DAUGHTER 32LQFP ST7FLITE4M	0
	ST7MDT10-TEB STMicroelectronics	BOARD TARGET EMULATION EMU3	0
	ST7MDT20-T80/DVP STMicroelectronics	KIT CONNECTOR FOR STMDT20 80TQFP	0
	AC7MDT10-D32/S28 STMicroelectronics	KIT CONN SDIP32/SO28 ST7MDT10	0
	AC7MDT20-T64/14 STMicroelectronics	KIT CONN TQFP64 FOR ST7MDT20M	0
	AS-DIP-SO STMicroelectronics	MCU BOARD ADAPTER DIP/SO ST7	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization