Accessories

Image Part Number Description / PDF Quantity Rfq
I3-TRACER1

I3-TRACER1

RF Solutions

BOARD ADD ON TRACE

3

DB756

DB756

RF Solutions

BOARD DAUGHTER ICEPIC2

2

I3DBF77

I3DBF77

RF Solutions

BOARD DAUGHTER ICEPIC3

4

I3-DB18F4431

I3-DB18F4431

RF Solutions

BOARD DAUGHTER ICEPIC3

9

DB5XA

DB5XA

RF Solutions

BOARD DAUGHTER ICEPIC

1

I3DBF777

I3DBF777

RF Solutions

BOARD DAUGHTER ICEPIC3

0

DB84A

DB84A

RF Solutions

BOARD DAUGHTER ICEPIC

0

DB66X

DB66X

RF Solutions

BOARD DAUGHTER ICEPIC

0

I3DB12F675

I3DB12F675

RF Solutions

BOARD DAUGHTER ICEPIC3

0

DB62X

DB62X

RF Solutions

BOARD DAUGHTER ICEPIC

0

I3-DB16F84A

I3-DB16F84A

RF Solutions

BOARD DAUGHTER ICEPIC3

0

I3DBF88

I3DBF88

RF Solutions

BOARD DAUGHTER ICEPIC3

0

I3DBF676

I3DBF676

RF Solutions

BOARD DAUGHTER ICEPIC3

0

DB74A

DB74A

RF Solutions

BOARD DAUGHTER ICEPIC

0

DB711

DB711

RF Solutions

BOARD DAUGHTER ICEPIC

0

I3DB18F4320

I3DB18F4320

RF Solutions

BOARD DAUGHTER ICEPIC3

0

I3-DB16F871

I3-DB16F871

RF Solutions

BOARD DAUGHTER ICEPIC3

0

DB55X

DB55X

RF Solutions

BOARD DAUGHTER ICEPIC

0

DB715

DB715

RF Solutions

BOARD DAUGHTER ICEPIC

0

I3-DB18F4550

I3-DB18F4550

RF Solutions

BOARD DAUGHTER ICEPIC3

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

RFQ BOM Call Skype Email
Top