Accessories

Image Part Number Description / PDF Quantity Rfq
QB-78K0KX1H-DA

QB-78K0KX1H-DA

Renesas Electronics America

DEVICE ADAPTER

0

YR0K77210B000BE

YR0K77210B000BE

Renesas Electronics America

TFT LCD ACCSSRY RZ/A1H RSK & RZ/

4

M37273E8SS

M37273E8SS

Renesas Electronics America

MICROCONTROLLER, 8-BIT

0

R0E000010ACB20

R0E000010ACB20

Renesas Electronics America

ISOLATOR E1 4.05 RX600

0

R0E000010CKZ11

R0E000010CKZ11

Renesas Electronics America

ADAPTER FOR E1 EMULATOR

2

M37542RSS

M37542RSS

Renesas Electronics America

740 GROUP EMULATOR DEDICATED MCU

0

R0E000010CKZ00

R0E000010CKZ00

Renesas Electronics America

ADAPTER FOR E1 EMULATOR

0

QB-208-EP-01S

QB-208-EP-01S

Renesas Electronics America

EXTENSION PROBE

0

M38507ARLSS

M38507ARLSS

Renesas Electronics America

8-BIT, 740/3850 CPU

0

Y-JLINK-RX-ADAPTER

Y-JLINK-RX-ADAPTER

Renesas Electronics America

J-LINK RX ADAPTER 8.06.01

0

R0E521000EPB00

R0E521000EPB00

Renesas Electronics America

PROBE EMULATOR FOR PC7501

0

935295616598

935295616598

Renesas Electronics America

BOARD EVAL HSDC-EXTMOD02A

0

R0E001000EXT00

R0E001000EXT00

Renesas Electronics America

ACCY EXT TRIGGER CABLE E100

0

R0E0100TNPFJ00

R0E0100TNPFJ00

Renesas Electronics America

CONV BOARD FOR FLX10 TO 100QFP

0

R0E521276EPB00

R0E521276EPB00

Renesas Electronics America

DEV EMULAT PERSON KIT-R8C26/27

0

QB-208-EP-02S

QB-208-EP-02S

Renesas Electronics America

EMULATION PROBE

0

R0E0100TNPFK00

R0E0100TNPFK00

Renesas Electronics America

CONV BOARD FOR FLX10 TO 100LQFP

0

HSDC-EXTMOD03B-DB

HSDC-EXTMOD03B-DB

Renesas Electronics America

MOD EXTENSION EXTMOD03

0

HS6000EIU02H

HS6000EIU02H

Renesas Electronics America

EMULATOR USB INTERFACE

0

HSDC-EXTMOD01-DB

HSDC-EXTMOD01-DB

Renesas Electronics America

MOD EXTENSION EXTMOD01

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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