Programmable Oscillators

Part Number	Description / PDF	Quantity
ASSVP1-R-C02 Abracon	XTAL OSC PROG XO CMOS CS 2.5V	0
ASSVP1-R-D04 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASEMPLV-BLANK-LR-T Abracon	MEMS OSC PRG BLANK 2.3MHZ-460MHZ	0
AP3S3EJ Abracon	XTAL OSC PROG XO CMOS 3.3V 20PPM	1012
ASDMB-BLANK-EY Abracon	MEMS OSC PROG BLANK 1MHZ-150MHZ	0
ASSVP1-D04 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASSFLP1-D03 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASEMPHC-BLANK-LR-T Abracon	MEMS OSC PRG BLANK 2.3MHZ-460MHZ	0
ASSVP1-R-D16 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASSVP-C16 Abracon	XTAL OSC PROG XO CMOS CS 3.3V	0
ASVMB-BLANK-L Abracon	MEMS OSC PROG BLANK 1MHZ-150MHZ	0
ASSVP-D02 Abracon	XTAL OSC PROG XO CMOS DS 3.3V	0
ASSVP1-R-D02 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASSVP-R-D16 Abracon	XTAL OSC PROG XO CMOS DS 3.3V	0
AP3S2EC Abracon	XTAL OSC PROG XO CMOS 1.8V 50PPM	1022
ASSVP-R-C04 Abracon	XTAL OSC PROG XO CMOS CS 3.3V	0
ASSFLP1-R-D08 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASSVP1-R-D06 Abracon	XTAL OSC PROG XO CMOS DS 2.5V	0
ASSFLP-C08 Abracon	XTAL OSC PROG XO CMOS CS 3.3V	0
ASSFLP1-C08 Abracon	XTAL OSC PROG XO CMOS CS 2.5V	0

Programmable Oscillators

1. Overview

Programmable oscillators are frequency generation devices that allow dynamic adjustment of output frequency through digital control. Unlike fixed-frequency crystals or resonators, these oscillators use phase-locked loop (PLL) circuits or direct digital synthesis (DDS) to achieve precise frequency tuning. Their adaptability makes them critical components in modern communication systems, industrial automation, and high-speed computing equipment where frequency agility and phase noise optimization are required.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Phase-Locked Loop (PLL) Oscillators	Frequency synthesis through feedback control, offers high stability	Wireless base stations, frequency converters
Direct Digital Synthesis (DDS)	Programmable frequency resolution down to micro-Hertz levels	Test equipment, medical imaging systems
Temperature-Compensated Oscillators (TCXO)	Embedded temperature sensors for stability in varying environments	GPS receivers, automotive navigation systems
Voltage-Controlled Crystal Oscillators (VCXO)	Analog frequency adjustment via control voltage	Telecom transceivers, precision timing devices

3. Structure and Components

Typical programmable oscillator architecture includes: 1) Quartz crystal or MEMS resonator for base frequency reference 2) PLL/DDS circuit with programmable dividers 3) Digital control interface (I2C/SPI) 4) Voltage-controlled oscillator core 5) Output buffer amplifier 6) Temperature compensation module (for TCXO variants) Advanced packages integrate EEPROM for storing configuration profiles and phase noise optimization algorithms.

4. Key Technical Specifications

Parameter	Importance	Typical Values
Frequency Range	Determines application suitability	10 MHz - 1.5 GHz
Phase Noise	Critical for signal integrity	-150 to -165 dBc/Hz @ 1kHz offset
Tuning Resolution	Affects precision capability	0.1 Hz - 10 kHz
Power Consumption	Key for portable devices	50-300 mA
Temperature Stability	Impacts long-term reliability	0.5 to 2.5 ppm
Startup Time	Determines system response speed	1-10 ms

5. Application Fields

Telecommunications: 5G base stations, optical transceivers
Automotive: ADAS radar systems, V2X communication modules
Industrial: Precision test equipment, robotics controllers
Consumer Electronics: High-end audio clocks, gaming peripherals
Aerospace: Satellite communication terminals, navigation systems

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
SiTime	SiT8924	MEMS-based, 20 ppm stability, 10-110 MHz range
Texas Instruments	LMX2594	15 GHz PLL with integrated VCO, <35 fs jitter
Analog Devices	AD9914	125 MHz DDS with 48-bit tuning word
STMicroelectronics	VL53L3CX	Time-of-flight sensor with integrated oscillator

7. Selection Guidelines

Define required frequency range and tuning step
Assess phase noise requirements based on system SNR targets
Consider environmental operating conditions (temperature, vibration)
Evaluate interface compatibility (I2C/SPI vs analog control)
Analyze power budget constraints
Check package size and PCB integration requirements
Verify long-term stability specifications for mission-critical applications

8. Industry Trends

Key development directions include: - Integration of AI-based frequency prediction algorithms - MEMS resonator adoption enabling higher shock resistance - Sub-100 femtosecond jitter performance through advanced PLL architectures - System-on-Chip (SoC) integration reducing external component requirements - Expansion into millimeter-wave frequency bands (above 30 GHz) - Energy harvesting capabilities for IoT applications