Programmable Oscillators

Part Number	Description / PDF	Quantity
SG-9101CB-D05SGDBA Epson	XTAL OSC PROG XO CMOS DWN SPRD	180
SG-9101CB-C20SGCCB Epson	XTAL OSC PROG XO CMOS CTR SPRD	180
SG-9101CA-D20PGDAB Epson	XTAL OSC PROG XO CMOS DWN SPRD	112
SG-9101CG-D05SHCBC Epson	XTAL OSC PROG XO CMOS DWN SPRD	386
591HA-BDG Silicon Labs	XTAL OSC PROG XO CML 2.5V 50PPM	0
SG-9101CA-C15PGAAA Epson	XTAL OSC PROG XO CMOS CTR SPRD	112
ASSFLP1-C02 Abracon	XTAL OSC PROG XO CMOS CS 2.5V	0
CPPT1-HT5RP Cardinal Components	OSC PROG TTL 5V 25PPM STBY	46
SG-9101CE-C07SGBBA Epson	XTAL OSC PROG XO CMOS CTR SPRD	1019
SG-9101CE-D10SGACA Epson	XTAL OSC PROG XO CMOS DWN SPRD	1019
SG-9101CE-D20PHDAA Epson	XTAL OSC PROG XO CMOS DWN SPRD	1019
591DD-CDG Silicon Labs	XTAL OSC PROG XO CML 3.3V 7PPM	0
511HCA-BBAG Silicon Labs	XTAL OSC PROG XO HCSL 2.5V 20PPM	0
SG-9101CE-D10SGDBC Epson	XTAL OSC PROG XO CMOS DWN SPRD	1019
SG-8003CE-PCC Epson	XTAL OSC PRG XO CMOS 3.3V 100PPM	496
SG-9101CG-C10SHBBC Epson	XTAL OSC PROG XO CMOS CTR SPRD	386
SGR-8002JC-SCC Epson	XTAL OSC PRG XO CMOS 3.3V 100PPM	0
SG-9101CA-C15PHCBA Epson	XTAL OSC PROG XO CMOS CTR SPRD	112
SG-9101CE-D15SGABC Epson	XTAL OSC PROG XO CMOS DWN SPRD	1019
SG-9101CA-D30SHCBA Epson	XTAL OSC PROG XO CMOS DWN SPRD	112

Programmable Oscillators

1. Overview

Programmable oscillators are frequency generation devices that allow dynamic adjustment of output frequency through digital control. Unlike fixed-frequency crystals or resonators, these oscillators use phase-locked loop (PLL) circuits or direct digital synthesis (DDS) to achieve precise frequency tuning. Their adaptability makes them critical components in modern communication systems, industrial automation, and high-speed computing equipment where frequency agility and phase noise optimization are required.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Phase-Locked Loop (PLL) Oscillators	Frequency synthesis through feedback control, offers high stability	Wireless base stations, frequency converters
Direct Digital Synthesis (DDS)	Programmable frequency resolution down to micro-Hertz levels	Test equipment, medical imaging systems
Temperature-Compensated Oscillators (TCXO)	Embedded temperature sensors for stability in varying environments	GPS receivers, automotive navigation systems
Voltage-Controlled Crystal Oscillators (VCXO)	Analog frequency adjustment via control voltage	Telecom transceivers, precision timing devices

3. Structure and Components

Typical programmable oscillator architecture includes: 1) Quartz crystal or MEMS resonator for base frequency reference 2) PLL/DDS circuit with programmable dividers 3) Digital control interface (I2C/SPI) 4) Voltage-controlled oscillator core 5) Output buffer amplifier 6) Temperature compensation module (for TCXO variants) Advanced packages integrate EEPROM for storing configuration profiles and phase noise optimization algorithms.

4. Key Technical Specifications

Parameter	Importance	Typical Values
Frequency Range	Determines application suitability	10 MHz - 1.5 GHz
Phase Noise	Critical for signal integrity	-150 to -165 dBc/Hz @ 1kHz offset
Tuning Resolution	Affects precision capability	0.1 Hz - 10 kHz
Power Consumption	Key for portable devices	50-300 mA
Temperature Stability	Impacts long-term reliability	0.5 to 2.5 ppm
Startup Time	Determines system response speed	1-10 ms

5. Application Fields

Telecommunications: 5G base stations, optical transceivers
Automotive: ADAS radar systems, V2X communication modules
Industrial: Precision test equipment, robotics controllers
Consumer Electronics: High-end audio clocks, gaming peripherals
Aerospace: Satellite communication terminals, navigation systems

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
SiTime	SiT8924	MEMS-based, 20 ppm stability, 10-110 MHz range
Texas Instruments	LMX2594	15 GHz PLL with integrated VCO, <35 fs jitter
Analog Devices	AD9914	125 MHz DDS with 48-bit tuning word
STMicroelectronics	VL53L3CX	Time-of-flight sensor with integrated oscillator

7. Selection Guidelines

Define required frequency range and tuning step
Assess phase noise requirements based on system SNR targets
Consider environmental operating conditions (temperature, vibration)
Evaluate interface compatibility (I2C/SPI vs analog control)
Analyze power budget constraints
Check package size and PCB integration requirements
Verify long-term stability specifications for mission-critical applications

8. Industry Trends

Key development directions include: - Integration of AI-based frequency prediction algorithms - MEMS resonator adoption enabling higher shock resistance - Sub-100 femtosecond jitter performance through advanced PLL architectures - System-on-Chip (SoC) integration reducing external component requirements - Expansion into millimeter-wave frequency bands (above 30 GHz) - Energy harvesting capabilities for IoT applications