Oscillators

Image Part Number Description / PDF Quantity Rfq
O 32,0-JT33-B-K-3,3-LF

O 32,0-JT33-B-K-3,3-LF

Jauch Quartz

XTAL OSC TCXO 32.0000MHZ SNWV

0

O 26,0-JT21G-E-M-3,3-LF

O 26,0-JT21G-E-M-3,3-LF

Jauch Quartz

OSC TCXO 26MHZ 3.3V SNWV

0

O 32,0-JT22S-B-K-3,3-LF

O 32,0-JT22S-B-K-3,3-LF

Jauch Quartz

XTAL OSC TCXO 32.0000MHZ SNWV

0

O 26,0-JT21G-E-M-1,8-LF

O 26,0-JT21G-E-M-1,8-LF

Jauch Quartz

OSC TCXO 26MHZ 1.8V SNWV

0

O 12,80-JT33-B-K-3,3-LF

O 12,80-JT33-B-K-3,3-LF

Jauch Quartz

XTAL OSC TCXO 12.8000MHZ SNWV

0

Oscillators

1. Overview

Oscillators are electronic components that generate stable periodic signals, serving as frequency references in electronic systems. Crystals and resonators are core elements that determine frequency stability through mechanical vibration. These components are critical in modern technology for ensuring synchronization, timing accuracy, and signal integrity in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Crystal Oscillator (XO)Fixed frequency output, high stabilityMicrocontrollers, clocks
Voltage-Controlled Crystal Oscillator (VCXO)Frequency adjustable via control voltageTelecom networks, phase-locked loops
Temperature-Compensated Crystal Oscillator (TCXO)Integrated temperature compensation circuitGPS devices, mobile phones
Oven-Controlled Crystal Oscillator (OCXO)Heated enclosure for ultra-high stabilityTest equipment, military radar
Microwave ResonatorHigh-frequency operation using dielectric materials5G base stations, satellite communication

3. Structure and Components

A typical oscillator consists of:

  • Crystal unit (quartz or ceramic resonator)
  • Amplification circuit (transistor/IC)
  • Feedback network (LC/pi-filter)
  • Power supply regulation
  • Metal/ceramic hermetic enclosure
Quartz crystals are cut in AT or SC configurations for optimal temperature response. Advanced packages integrate phase noise reduction circuitry and digital control interfaces.

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational frequency band (kHz to GHz)Determines application suitability
Stability (ppm)Frequency deviation over temperature/timeSystem reliability indicator
Phase NoiseShort-term frequency fluctuations (dBc/Hz)Critical for RF communication
Start-up TimeTime to reach stable oscillationPower-sensitive applications
Operating TemperatureFunctional temperature rangeEnvironmental adaptability

5. Application Fields

  • Telecommunications: 5G base stations, optical transceivers
  • Consumer Electronics: Smartphones, wearables
  • Automotive: ADAS sensors, engine control units (ECUs)
  • Industrial: Test equipment, precision sensors
  • Aerospace: Satellite navigation systems, flight computers

Case Study

The SiTime SiT5358 MEMS oscillator ( 0.1ppm stability) enables 5G small cells to maintain synchronization within 1588v2 standards. Compared to traditional TCXO solutions, it reduces holdover drift by 80% while maintaining better vibration resistance.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
EpsonTG-550032.768kHz TCXO, 0.03ppm stability
SiTimeSiT89240.1ppm MEMS oscillator with 70MHz output
TXC Corporation7B-26.000MAAJ26MHz VCXO for Bluetooth modules
CrystekCFOV-950-100.000100MHz OCXO with -145dBc/Hz phase noise

7. Selection Guidelines

  • Determine frequency requirements (fundamental vs overtone mode)
  • Evaluate stability needs (temperature range, aging tolerance)
  • Assess phase noise requirements (critical for high-speed ADC/DAC)
  • Consider package size (common: 2016, 3225, 5032)
  • Verify power consumption (important for IoT devices)
  • Select appropriate compensation method (TCXO vs OCXO)

8. Industry Trends

Key developments include:

  • MEMS oscillators replacing quartz in high-vibration environments
  • Integration of digital control (I2C programmable oscillators)
  • Development of sub-ppm stability at consumer price points
  • Miniaturization to meet wearable device demands
  • Increased adoption of differential output formats (LVPECL, HCSL)
The market is projected to grow at 6.8% CAGR through 2028, driven by 5G infrastructure and automotive electronics demand.

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