Accessories

Image Part Number Description / PDF Quantity Rfq
M432465

M432465

Taitien

CRYSTAL OVEN MINI 24V 65C

10

M051575

M051575

Taitien

CRYSTAL OVEN MINI 15V 75C

8

M052880

M052880

Taitien

CRYSTAL OVEN MINI 28V 80C

10

MAJ4324

MAJ4324

Taitien

CRYSTAL OVEN MINI 24V VARI TEMP

10

M051275

M051275

Taitien

CRYSTAL OVEN MINI 12V 75C

10

MAJ0515

MAJ0515

Taitien

CRYSTAL OVEN MINI 15V VARI TEMP

10

M431280

M431280

Taitien

CRYSTAL OVEN MINI 12V 80C

10

MAJ4320

MAJ4320

Taitien

CRYSTAL OVEN MINI 20V VARI TEMP

10

M051260

M051260

Taitien

CRYSTAL OVEN MINI 12V 60C

10

M051285

M051285

Taitien

CRYSTAL OVEN MINI 12V 85C

10

M430570

M430570

Taitien

CRYSTAL OVEN MINI 5V 70C

10

M052870

M052870

Taitien

CRYSTAL OVEN MINI 28V 70C

10

M051588

M051588

Taitien

CRYSTAL OVEN MINI 15V 88C

10

M052075

M052075

Taitien

CRYSTAL OVEN MINI 20V 75C

10

M051680

M051680

Taitien

CRYSTAL OVEN MINI 16V 80C

10

M052685

M052685

Taitien

CRYSTAL OVEN MINI 26V 85C

10

MAJ0528

MAJ0528

Taitien

CRYSTAL OVEN MINI 28V VARI TEMP

10

M051266

M051266

Taitien

CRYSTAL OVEN MINI 12V 66C

10

M431550

M431550

Taitien

CRYSTAL OVEN MINI 15V 50C

10

M431260

M431260

Taitien

CRYSTAL OVEN MINI 12V 60C

10

Accessories

1. Overview

Crystals, oscillators, and resonators are passive electronic components that generate stable frequency references through mechanical vibration or piezoelectric effects. These components are critical for timing control, signal generation, and frequency synchronization in modern electronic systems. Their precision and stability directly affect the performance of communication systems, industrial equipment, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Quartz CrystalsHigh-frequency stability, low phase noiseMicroprocessors, communication transceivers
Ceramic ResonatorsLower cost, moderate stabilityConsumer electronics, remote controls
XO (Crystal Oscillators)Integrated oscillator circuits, fixed frequencyNetworking equipment, GPS modules
TCXO (Temperature-Compensated XOs)Stability against temperature variationsMobile phones, aerospace systems
VCXO (Voltage-Controlled XOs)Frequency tuning via voltage inputTelecom infrastructure, test equipment

3. Structure and Composition

Typical components include:

  • Crystals: Piezoelectric material (quartz/ ) with metal electrodes, hermetically sealed in metal/glass packages.
  • Oscillators: Crystal/resonator integrated with oscillation circuitry (e.g., amplifiers, feedback loops) in a single package.
  • Resonators: Ceramic/piezoelectric elements with resonant cavity structures, often combined with passive circuit components.
  • Accessories include mounting brackets, EMI shielding covers, and thermal interface materials for vibration/noise suppression.

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational frequency band (kHz-MHz)Determines application compatibility
Stability (ppm)Frequency deviation toleranceImpacts system reliability
Operating TemperatureTemperature range (-40 C to +85 C)Environmental adaptability
Phase NoiseShort-term frequency instabilitySignal integrity in RF systems
Drive LevelPower consumption for oscillationBattery efficiency in portable devices

5. Application Fields

  • Telecommunications: 5G base stations, fiber optic networks
  • Consumer Electronics: Smartphones, wearables
  • Industrial: CNC machines, IoT sensors
  • Automotive: ADAS systems, engine controllers
  • Aerospace: Navigation systems, satellite transponders

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
EpsonSG-8003Low-jitter TCXO for industrial automation
MurataCSTCECeramic resonator for automotive applications
TXC Corporation9B-120.000High-frequency XO for networking equipment
SiTimeSi5335MEMS-based oscillator with 0.5ppm stability

7. Selection Guidelines

Key considerations:

  • Frequency accuracy vs. cost trade-offs
  • Environmental conditions (temperature, vibration)
  • Power consumption requirements (e.g., IoT devices)
  • Package size constraints (SMD vs. through-hole)
  • Example: Automotive applications require AEC-Q qualified components with 25ppm stability.

8. Industry Trends

Future directions include:

  • Micromachining (MEMS) replacing traditional quartz crystals
  • Integration with AI-driven frequency calibration
  • Sub-0.1ppm stability for 5G/6G infrastructure
  • Miniaturization to 0.4mm x 0.2mm packages
  • Increased adoption of oven-controlled oscillators (OCXOs) in edge computing
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