Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	DSC-PROG-8103-3225 Roving Networks / Microchip Technology	KIT 6POS 3.2X2.5 SOCKET DSC8103	0
	2-1437503-1 TE Connectivity AMP Connectors	CONN CRYSTAL SOCKT SUB-MINI GOLD	0
	1-1437503-7 TE Connectivity AMP Connectors	SOCKET CRYSTAL ASSY GOLD	0
	DSC-PROG-8103-5032 Roving Networks / Microchip Technology	KIT 6POS 5.0X3.2 SOCKET DSC8103	0
	DSC-PROG-8102-2520 Roving Networks / Microchip Technology	KIT 6POS 2.5X2.0 SOCKET DSC8102	0
	DSC-PROG-8103-2520 Roving Networks / Microchip Technology	KIT 6POS 2.5X2.0 SOCKET DSC8103	0
	473-015 Califia Lighting (Bivar)	HDWR INS TAB	0
	472-045 Califia Lighting (Bivar)	HDWR INS TAB	0
	DSC-PROG-8103-7050 Roving Networks / Microchip Technology	KIT 6POS 7.0X5.0 SOCKET DSC8103	0
	DSC-PROG-8124-3225 Roving Networks / Microchip Technology	KIT 4POS 5.0X3.2 SOCKET	0
	472-015 Califia Lighting (Bivar)	HDWR INS TAB	0
	DSC-PROG-8002-5032 Roving Networks / Microchip Technology	KIT 4POS 3.2X2.5 SOCKET	0
	DSC-PROG-8122-7050 Roving Networks / Microchip Technology	KIT 4POS 5.0X3.2 SOCKET	0
	DSC-PROG-8102-7050 Roving Networks / Microchip Technology	KIT 6POS 7.0X5.0 SOCKET DSC8102	0
	1437503-7 TE Connectivity AMP Connectors	CONN SUB-MINI SOCKET ASSY RT ANG	0
	1-1437503-3 TE Connectivity AMP Connectors	CRYSTAL SOCKET ASSY SUB MINI AU	0
	472-035 Califia Lighting (Bivar)	HDWR INS TAB	0
	1437503-9 TE Connectivity AMP Connectors	SOCKET	0

Accessories

1. Overview

Crystals, oscillators, and resonators are passive electronic components that generate stable frequency references through mechanical vibration or piezoelectric effects. These components are critical for timing control, signal generation, and frequency synchronization in modern electronic systems. Their precision and stability directly affect the performance of communication systems, industrial equipment, and consumer electronics.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Quartz Crystals	High-frequency stability, low phase noise	Microprocessors, communication transceivers
Ceramic Resonators	Lower cost, moderate stability	Consumer electronics, remote controls
XO (Crystal Oscillators)	Integrated oscillator circuits, fixed frequency	Networking equipment, GPS modules
TCXO (Temperature-Compensated XOs)	Stability against temperature variations	Mobile phones, aerospace systems
VCXO (Voltage-Controlled XOs)	Frequency tuning via voltage input	Telecom infrastructure, test equipment

3. Structure and Composition

Typical components include:

Crystals: Piezoelectric material (quartz/ ) with metal electrodes, hermetically sealed in metal/glass packages.
Oscillators: Crystal/resonator integrated with oscillation circuitry (e.g., amplifiers, feedback loops) in a single package.
Resonators: Ceramic/piezoelectric elements with resonant cavity structures, often combined with passive circuit components.
Accessories include mounting brackets, EMI shielding covers, and thermal interface materials for vibration/noise suppression.

4. Key Technical Specifications

Parameter	Description	Importance
Frequency Range	Operational frequency band (kHz-MHz)	Determines application compatibility
Stability (ppm)	Frequency deviation tolerance	Impacts system reliability
Operating Temperature	Temperature range (-40 C to +85 C)	Environmental adaptability
Phase Noise	Short-term frequency instability	Signal integrity in RF systems
Drive Level	Power consumption for oscillation	Battery efficiency in portable devices

5. Application Fields

Telecommunications: 5G base stations, fiber optic networks
Consumer Electronics: Smartphones, wearables
Industrial: CNC machines, IoT sensors
Automotive: ADAS systems, engine controllers
Aerospace: Navigation systems, satellite transponders

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Epson	SG-8003	Low-jitter TCXO for industrial automation
Murata	CSTCE	Ceramic resonator for automotive applications
TXC Corporation	9B-120.000	High-frequency XO for networking equipment
SiTime	Si5335	MEMS-based oscillator with 0.5ppm stability

7. Selection Guidelines

Key considerations:

Frequency accuracy vs. cost trade-offs
Environmental conditions (temperature, vibration)
Power consumption requirements (e.g., IoT devices)
Package size constraints (SMD vs. through-hole)
Example: Automotive applications require AEC-Q qualified components with 25ppm stability.

8. Industry Trends

Future directions include:

Micromachining (MEMS) replacing traditional quartz crystals
Integration with AI-driven frequency calibration
Sub-0.1ppm stability for 5G/6G infrastructure
Miniaturization to 0.4mm x 0.2mm packages
Increased adoption of oven-controlled oscillators (OCXOs) in edge computing