Terminals - Wire to Board Connectors

Image	Part Number	Description / PDF	Quantity	Rfq
	SIN-81T-3.6S JST	CONN TERM WTB 12AWG TIN	0
	SIN-61T-2.6S JST	CONN TERM WTB 14AWG TIN	0
	SIN-21T-1.8 JST	CONN TERM WTB 18-22AWG TIN	0
	SIN-002T-1.0 JST	CONN TERM WTB 26-28AWG TIN	0
	SIN-21T-1.8S JST	CONN TERM WTB 18-22AWG TIN	0
	SIN-41T-2.4S JST	CONN TERM WTB 16-18AWG TIN	0

Terminals - Wire to Board Connectors

1. Overview

Wire-to-board connectors are electro-mechanical devices that establish removable electrical connections between wires/cables and printed circuit boards (PCBs). They enable efficient assembly, maintenance, and scalability in electronic systems by providing reliable signal/power transmission while allowing disconnection for servicing or upgrades. These connectors are critical in modern electronics for their role in integrating wiring harnesses with control circuitry.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
IDC (Insulation Displacement Connectors)	Cut through wire insulation without soldering, quick termination	Telecom equipment, consumer electronics
Crimp Terminal Connectors	Pressure-formed metal crimp for vibration resistance	Automotive control modules, industrial machinery
Screw Terminal Blocks	Adjustable clamping force via screws	Power distribution panels, HVAC systems
PUSH-IN Connectors	Tool-less wire insertion with spring clamps	Lighting systems, building automation
Latch-Type Connectors	Secure locking mechanisms to prevent accidental disconnection	Medical devices, aerospace avionics

3. Structural Composition

Typical structure includes:

Contact: Phosphor bronze or beryllium copper with gold/tin plating (0.1-3.0 m thickness)
Insulation Housing: High-temperature resistant thermoplastics (e.g., LCP, PBT)
Wire Sealing: Silicone rubber or thermoplastic elastomers for strain relief
Shielding: Optional EMI/RFI protection with conductive coatings

Modular designs often feature polarization keys and color coding for error-proof mating.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A - 30A	Determines conductor size and thermal performance
Dielectric Strength	500V - 5000V AC	Ensures electrical safety in high-voltage applications
Contact Resistance	5-50m	Impacts signal integrity and power efficiency
Insertion Force	0.5-20N	Affects assembly ergonomics and connector durability
Operating Temperature	-55 C to +150 C	Defines material stability in extreme conditions
Mating Cycles	500-10,000 cycles	Indicates product lifespan in serviceable applications

5. Application Domains

Consumer Electronics: Smartphones, laptops, home appliances
Automotive: Engine control units, sensor harnesses, infotainment systems
Industrial Automation: PLCs, motor drives, factory IoT devices
Medical Equipment: Diagnostic imaging systems, patient monitors
Renewable Energy: Solar inverters, wind turbine controllers

Example: TE Connectivity's AMPMODU connectors used in Tesla Model S battery management system.

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Specifications
TE Connectivity	MINI50 Series	0.5mm contact pitch, 3A rating, automotive qualified
Molex	PicoBlade 0.8mm	Space-saving design for wearable devices
Amphenol ICC	FCI 100 Series	High-vibration resistance for industrial machinery
Phoenix Contact	COMBICON MT Series	Push-in wiring for control cabinets
JAE Electronics	XT3 Series	IP67-rated for outdoor equipment

7. Selection Guidelines

Key considerations:

Electrical Requirements: Match current/voltage ratings with system needs
Termination Method: Choose between crimp, solder, or IDC based on production capabilities
Environmental Factors: Consider temperature, humidity, and vibration exposure
Space Constraints: Evaluate connector height and footprint vs PCB layout
Total Cost of Ownership: Factor in tooling costs, assembly time, and field serviceability

Recommend verifying with prototype testing under worst-case operating conditions.

8. Industry Trends

Emerging developments:

Miniaturization: Sub-1.0mm contact pitch for mobile devices
High-Density Designs: Stacked connectors for EV battery management
Smart Connectivity: Integrated sensors for condition monitoring
Eco-friendly Materials: Halogen-free insulators and lead-free plating
Automated Assembly: Compatibility with robotic crimping/soldering systems

Market drivers: Electric vehicles (CAGR 22% 2023-2030), 5G infrastructure, and Industry 4.0 adoption.