Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
SPS-21T-250

SPS-21T-250

JST

CONN QC RCPT 18-22AWG 0.250

0

SPS-01T-187

SPS-01T-187

JST

CONN QC RCPT 20-26AWG 0.187

0

SFPS-41T-187-8

SFPS-41T-187-8

JST

CONTACT

0

SPS-51T-187

SPS-51T-187

JST

CONN QC RCPT 14-20AWG 0.187

0

STO-41T-187N

STO-41T-187N

JST

TAB-ON TERMINAL

0

SRSF-61T-250A

SRSF-61T-250A

JST

CONN QC RCPT 14-18AWG 0.250

0

FLVDDF2-250A(S)K

FLVDDF2-250A(S)K

JST

CONN QC RCPT 14-16AWG 0.250

0

SFO-41T-P187N-8

SFO-41T-P187N-8

JST

CONN QC RCPT 16-20AWG 0.187

0

SFPS-41T-187

SFPS-41T-187

JST

CONN QC RCPT 16-22AWG 0.187

0

SPS-61T-250

SPS-61T-250

JST

CONN QC RCPT 14-18AWG 0.250

0

FVDDF2-187A-5

FVDDF2-187A-5

JST

CONN QC RCPT 14-16AWG 0.187

0

SIM-41T-110B

SIM-41T-110B

JST

CONN QC TAB 16-20AWG 0.110 CRIMP

0

STO-01-187N

STO-01-187N

JST

CONN QC RCPT 20-24AWG 0.187

0

SFO-61T-250A

SFO-61T-250A

JST

TAB-ON FLAG TYPE TERMINAL

0

SFPS-61T-250

SFPS-61T-250

JST

CONN QC RCPT 14-18AWG 0.250

0

SPS-91T-250

SPS-91T-250

JST

CONN QC RCPT 10-14AWG 0.250

0

FVDDF2-375A

FVDDF2-375A

JST

CONN QC RCPT 14-16AWG 0.375

0

LVDDF5.5-250A(LF)

LVDDF5.5-250A(LF)

JST

QUICK CONNECT .250 10-12AWG

0

FLVZDF1.25-250A-TOR(S)(LF)

FLVZDF1.25-250A-TOR(S)(LF)

JST

QUICK DISCONNECT FEMAL, COPPER S

0

FVDDFM2-250B

FVDDFM2-250B

JST

QUICK DISCONNECT TERMINAL

0

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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