Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
0190030047

0190030047

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

1101

0190170004

0190170004

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.110

10607

0190250005

0190250005

Woodhead - Molex

CONN QC TAB 10-12AWG 0.250 CRIMP

1130

0190170032

0190170032

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

4845

0190030013

0190030013

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.187

126

0196060006

0196060006

Woodhead - Molex

CONN QC RCPT 10-12AWG 0.250

1534

0190010002

0190010002

Woodhead - Molex

CONN QC TAB 18-22AWG 0.250 CRIMP

683

0190030122

0190030122

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

0

0190170005

0190170005

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.110

6060

0190050003

0190050003

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

8304

0190030014

0190030014

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.187

2881

0190160035

0190160035

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.110

231111000

0197084013

0197084013

Woodhead - Molex

CONN QC TAB 0.187 SOLDER

7540

0190020021

0190020021

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.205

3237

0196001306

0196001306

Woodhead - Molex

CONN QC RCPT 16-22AWG 0.250

2242

0945120101

0945120101

Woodhead - Molex

CONN QC RCPT 18-24AWG 0.250

0

0190190030

0190190030

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

4243

0357252410

0357252410

Woodhead - Molex

CONN QC RCPT 14-18AWG 0.250

5177

0190070053

0190070053

Woodhead - Molex

CONN QC RCPT 10-12AWG 0.250

50

0190030053

0190030053

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

2408

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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