Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
MVU18-250DFX-BOTTLE

MVU18-250DFX-BOTTLE

3M

CONN QC RCPT 18-22AWG 0.25 100PC

3

94828

94828

3M

CONN QC TAB 14-16AWG 0.250 CRIMP

3325

MNU10-250DFIX-BOTTLE

MNU10-250DFIX-BOTTLE

3M

CONN QC RCPT 10-12AWG 0.250 50PC

0

94808

94808

3M

CONN QC TAB 18-22AWG 0.187 CRIMP

607

94823

94823

3M

CONN QC TAB 14-16AWG 0.187 CRIMP

878

MVU18-250DMFX-A-BOTTLE

MVU18-250DMFX-A-BOTTLE

3M

CONN QC RCPT/TAB 18-22AWG 100PC

0

MU14-250DFHTK

MU14-250DFHTK

3M

CONN QC RCPT 14-16AWG 0.250

0

MVU14-110DFK-A

MVU14-110DFK-A

3M

CONN FORK

0

MNGI14-250DFX-BOTTLE

MNGI14-250DFX-BOTTLE

3M

CONN QC RCPT 14-16AWG 0.25 100PC

0

MNHU18-250DFIX-BOTTLE

MNHU18-250DFIX-BOTTLE

3M

CONN QC RCPT 18-22AWG 0.250 25PC

0

MNG14-187DMX-BOTTLE

MNG14-187DMX-BOTTLE

3M

CONN QC TAB 14-16AWG 0.187 100PC

0

MU14-250DFHT/FLAGK

MU14-250DFHT/FLAGK

3M

CONN QC RCPT 14-16AWG 0.250

0

MNG14-187DFX-BOTTLE

MNG14-187DFX-BOTTLE

3M

CONN QC RCPT 14-16AWG .187 100PC

0

MNGI18-250DFK

MNGI18-250DFK

3M

CONN QC RCPT 18-22AWG 0.250

0

771-250-NB-A

771-250-NB-A

3M

CONN QC RCPT/TAB 18-22AWG 0.250

0

MNHU18-250DMIX-BOTTLE

MNHU18-250DMIX-BOTTLE

3M

CONN QC TAB 18-22AWG 0.250 25PC

0

72F-110-20-A

72F-110-20-A

3M

BULK SPECIALTY

0

MNG14-187DMIK

MNG14-187DMIK

3M

CONN QC TAB 14-16AWG 0.187 CRIMP

0

71M-187-20

71M-187-20

3M

CONN QC TAB 18-22AWG 0.187 CRIMP

0

72M-187-20

72M-187-20

3M

CONN QC TAB 14-16AWG 0.187 CRIMP

0

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

RFQ BOM Call Skype Email
Top