Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
1742881-1

1742881-1

TE Connectivity AMP Connectors

CONN QC RCPT 500-1900CMA 0.250

0

0190030044

0190030044

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

1756

0190160043

0190160043

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

2294

0190050014

0190050014

Woodhead - Molex

CONN QC RCPT 10-12AWG 0.250

654

42404-1

42404-1

TE Connectivity AMP Connectors

CONN QC RCPT 12-18AWG 0.250

2206

170349-2

170349-2

TE Connectivity AMP Connectors

CONN QC TAB 20-22AWG 0.250 CRIMP

1150

0190020034

0190020034

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.110

349

63520-1

63520-1

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.187

0

0190180005

0190180005

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

2753

DPF14-205FIB-M

DPF14-205FIB-M

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

6072000

182490-2

182490-2

TE Connectivity AMP Connectors

CONN QC RCPT 0.375 CRIMP

0

170032-5

170032-5

TE Connectivity AMP Connectors

CONN QC RCPT 14-20AWG 0.250

7380

76-IFD16-187

76-IFD16-187

NTE Electronics, Inc.

PVC INS FEMALE DISCONNECT

1510

1-170140-2

1-170140-2

TE Connectivity AMP Connectors

187 FLAG FASTON REC

0

63596-1

63596-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.187

39905

2178300-1

2178300-1

TE Connectivity AMP Connectors

6.3 SRS F-SPRING LIF RECEPTACLE

3182

150270-1

150270-1

TE Connectivity AMP Connectors

.375 FASTON RECEPTACLE

5934

170032-2

170032-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-20AWG 0.250

16842

140716-2

140716-2

TE Connectivity AMP Connectors

CONN QC RCPT 22-24AWG 0.110

19195

76-NFIMD16C

76-NFIMD16C

NTE Electronics, Inc.

NYLON FULLY INS MALE DISC 100 BA

3

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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