Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
76-NIPD22L

76-NIPD22L

NTE Electronics, Inc.

NYLON INS PIGGYBACK DISC 50 BAG

8

61048-1

61048-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

19385

41969-2

41969-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.250

1133

61914-1

61914-1

TE Connectivity AMP Connectors

CONN QC TAB 0.187

0

DV10-250-2K

DV10-250-2K

Panduit Corporation

CONN QC RCPT 10-12AWG 0.250

200014000

0190020029

0190020029

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

3130

1742686-1

1742686-1

TE Connectivity AMP Connectors

CONN QC TAB 0.250 SOLDER

0

76-FIFD16-250L

76-FIFD16-250L

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON 50 BAG

11

3240059

3240059

Phoenix Contact

CONN QC TAB 14-16AWG 0.250 CRIMP

0

1742971-3

1742971-3

TE Connectivity AMP Connectors

250 FASTON RECPT 016 BR

9943

63301-1

63301-1

TE Connectivity AMP Connectors

CONN QC TAB 15-22AWG 0.250 CRIMP

544

62253-2

62253-2

TE Connectivity AMP Connectors

CONN QC RCPT/TAB 10-14AWG 0.250

5890

76-NIMD16-250C

76-NIMD16-250C

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT 100 BA

4

MDD2-250-100

MDD2-250-100

Remington Industries

QUICK CONNECT TERM MALE 100PCS

48

7471287

7471287

Würth Elektronik Midcom

CIRCUIT-BOARD BLADE TERMINAL 6.3

1668

63968-1

63968-1

TE Connectivity AMP Connectors

CONN QC RCPT 0.205/0.250 SOLDER

27379

61048-2

61048-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

17515

0190160008

0190160008

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.187

6405

521282-1

521282-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.250

6900

DVF18-188-CY

DVF18-188-CY

Panduit Corporation

CONN QC RCPT 18-22AWG 0.187

154

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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