Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
1286-ST

1286-ST

Keystone Electronics Corp.

CONN QC TAB 0.205 SOLDER

2147483647

76-FIFD22-187L

76-FIFD22-187L

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON 50 BAG

16

63986-1

63986-1

TE Connectivity AMP Connectors

CONN QC TAB 0.250 SOLDER

59978

62109-2

62109-2

TE Connectivity AMP Connectors

CONN QC RCPT/TAB 14-18AWG 0.250

0

181903-1

181903-1

TE Connectivity AMP Connectors

CONN QC RCPT 13.5-17AWG 0.250

0

0192750005

0192750005

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

141

76-IFD16-250L

76-IFD16-250L

NTE Electronics, Inc.

PVC INS FEMALE DISCONNECT 50 BAG

4

MNG18-250DFIX-BOTTLE

MNG18-250DFIX-BOTTLE

3M

CONN QC RCPT 18-22AWG 0.25 100PC

10

76-NIFD16-110

76-NIFD16-110

NTE Electronics, Inc.

NYLON INS FEMALE DISCONN

1828

165616-5

165616-5

TE Connectivity AMP Connectors

CONN QC RCPT 13.5-15.5AWG 0.110

8766

638307222006

638307222006

Würth Elektronik Midcom

WR-FAST_THT MALE VERTICAL HEADER

100

DNF14-250M-C

DNF14-250M-C

Panduit Corporation

CONN QC TAB 14-16AWG 0.250 CRIMP

623

640174-1

640174-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.205

7861

6-160449-3

6-160449-3

TE Connectivity AMP Connectors

250 FASTIN-ON REC.

5851

63932-1

63932-1

TE Connectivity AMP Connectors

CONN QC TAB 18-22AWG 0.110 CRIMP

0

MTV18-250Q

MTV18-250Q

3M

MALE DISCON VINYL INS HIGHLAND

0

41500

41500

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.110

0

76-HIMD12

76-HIMD12

NTE Electronics, Inc.

HEAT SHRINK INS MALE DISC

900

EDV18-250M-L

EDV18-250M-L

Panduit Corporation

STRONGHOLD MALE DISCONNECT, VINY

4670550

927882-4

927882-4

TE Connectivity AMP Connectors

POS LOCK RECEPTACLE 6,3

0

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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