Terminals - PC Pin Receptacles, Socket Connectors

Part Number	Description / PDF	Quantity
0138-0-15-80-30-27-04-0 Mill-Max	CONN PIN RCPT	1379
0368-0-33-01-13-27-10-0 Mill-Max	CONN PIN RCPT .048-.064 SOLDER	3635
8016-0-15-15-07-27-10-0 Mill-Max	CONN PIN RCPT .065-.082 KNURL	1519
0554-0-15-01-11-27-10-0 Mill-Max	CONN PIN RCPT .015-.020 SOLDER	3673
0621-0-15-15-04-27-10-0 Mill-Max	ZERO PROFILE RECEPTACLE FOR LEAD	1381
9016-0-15-80-07-27-10-0 Mill-Max	CONN PIN RCPT	965
0401-0-15-15-47-27-04-0 Mill-Max	CONN PIN RCPT .025-.037 PRESSFIT	9654
0548-0-15-15-21-27-10-0 Mill-Max	CONN PIN RCPT .015-.022 SOLDER	1230
0548-0-15-01-11-27-10-0 Mill-Max	CONN PIN RCPT .015-.020 SOLDER	155
0132-0-15-15-30-27-04-0 Mill-Max	CONN PIN RCPT .015-.025 PRESSFIT	3043
7305-0-15-80-47-27-10-0 Mill-Max	CONN PIN RCPT	62
0616-0-18-15-07-27-10-0 Mill-Max	CONN PIN RCPT .065-.082 PRESSFIT	1222
0039-2-17-15-30-27-02-0 Mill-Max	CONN PIN RCPT .015-.025 PRESSFIT	3486
0145-0-15-15-30-27-04-0 Mill-Max	CONN PIN RCPT .015-.025 PRESSFIT	83073
0435-0-15-15-03-27-10-0 Mill-Max	CONN PIN RCPT .040-.060 SOLDER	502
8579-1-15-15-11-27-10-0 Mill-Max	CONN PIN RCPT .015-.020 SOLDER	60646
6561-0-15-15-05-27-10-0 Mill-Max	RECEPTACLE WITH NO TAIL	249
0359-0-15-80-34-27-10-0 Mill-Max	CONN PIN RCPT	2500
7310-0-01-15-00-00-08-0 Mill-Max	CONN PIN RCPT	1424
0329-0-15-15-34-27-10-0 Mill-Max	CONN PIN RCPT .032-.046 SOLDER	15287

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Right-Angle Pin Receptacles	90 orientation for space optimization	Desktop motherboard peripheral connections
Through-Hole Socket Connectors	High mechanical stability with PCB via mounting	Industrial control panel interfaces
High-Density Array Connectors	Miniaturized contacts for compact designs	Smartphone board-to-board connections
Power Pin Receptacles	Heavy-duty contacts for high-current applications	Server power distribution units

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT thermoplastic materials)
Contact springs (phosphor bronze with gold plating)
Polarization keying features
PCB mounting retention mechanisms
EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power handling capacity
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Withstanding Voltage	500V-1kV	Safety isolation requirement
Mating Cycles	500-10,000 cycles	Service life indicator
Operating Temperature	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Computer hardware (motherboards, GPUs)
Telecom infrastructure (5G base stations)
Automotive electronics (ECUs, sensors)
Medical devices (diagnostic equipment)
Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MICRO MATCH Series	0.8mm contact spacing, 3A rating
Amphenol ICC	SmartArray High-Speed Socket	10Gbps data rate capability
Molex	PicoBlade Connector System	Space-saving 1.25mm pitch design
Samtec	SEARAY High-Density Array	Up to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage needs)
Environmental conditions (temperature/humidity range)
Space constraints (board layout limitations)
Service life expectations (maintenance frequency)
Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

Miniaturization (sub-0.5mm contact pitch research)
High-speed signal optimization (5G/6G compatibility)
Integrated EMI shielding solutions
Advanced plating materials (nanocoatings for corrosion resistance)
Smart connector integration (embedded sensors for predictive maintenance)