Terminals - PC Pin Receptacles, Socket Connectors

Part Number	Description / PDF	Quantity
0677-0-15-01-30-27-10-0 Mill-Max	CONN PIN RCPT .015-.025 SOLDER	35790
4716-0-15-15-21-27-10-0 Mill-Max	RECEPTACLE WITH NO TAIL; ACCEPTS	914
712-87-123-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
712-87-113-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0627-0-15-15-21-27-10-0 Mill-Max	ZERO PROFILE RECEPTACLE FOR LEAD	4205
380598-2 TE Connectivity AMP Connectors	CONN PIN RCPT .018-.040 SOLDER	0
0284-0-15-15-16-27-10-0 Mill-Max	CONN PIN RCPT .022-.034 SOLDER	6143
2-331272-7 TE Connectivity AMP Connectors	CONN PIN RCPT .022-.025 SOLDER	0
645952-1 TE Connectivity AMP Connectors	CONN PIN RCPT .014-.026 PRESSFIT	0
D01-9823205 Harwin	CONN PIN RCPT .016-.020 SOLDER	0
0433-0-15-80-03-80-04-0 Mill-Max	CONN PIN RCPT	600
M8134-HC-8P2 TE Connectivity Aerospace Defense and Marine	CONN PIN RCPT .025-.035 SOLDER	0
712-87-138-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0284-0-15-80-16-14-10-0 Mill-Max	CONN PIN RCPT	0
6002-0-19-15-15-27-10-0 Mill-Max	CONN PIN RCPT .020-.032 SOLDER	0
5380598-2 TE Connectivity AMP Connectors	CONN PIN RCPT .018-.040 SOLDER	41498
0305-1-15-15-47-27-10-0 Mill-Max	CONN PIN RCPT .025-.037 SOLDER	6576
2-332095-2 TE Connectivity AMP Connectors	CONN PIN RCPT .013-.020 SOLDER	20000
1444 Keystone Electronics Corp.	CONN PIN RCPT .032-.046 SOLDER	198500
712-83-130-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Right-Angle Pin Receptacles	90 orientation for space optimization	Desktop motherboard peripheral connections
Through-Hole Socket Connectors	High mechanical stability with PCB via mounting	Industrial control panel interfaces
High-Density Array Connectors	Miniaturized contacts for compact designs	Smartphone board-to-board connections
Power Pin Receptacles	Heavy-duty contacts for high-current applications	Server power distribution units

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT thermoplastic materials)
Contact springs (phosphor bronze with gold plating)
Polarization keying features
PCB mounting retention mechanisms
EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power handling capacity
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Withstanding Voltage	500V-1kV	Safety isolation requirement
Mating Cycles	500-10,000 cycles	Service life indicator
Operating Temperature	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Computer hardware (motherboards, GPUs)
Telecom infrastructure (5G base stations)
Automotive electronics (ECUs, sensors)
Medical devices (diagnostic equipment)
Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MICRO MATCH Series	0.8mm contact spacing, 3A rating
Amphenol ICC	SmartArray High-Speed Socket	10Gbps data rate capability
Molex	PicoBlade Connector System	Space-saving 1.25mm pitch design
Samtec	SEARAY High-Density Array	Up to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage needs)
Environmental conditions (temperature/humidity range)
Space constraints (board layout limitations)
Service life expectations (maintenance frequency)
Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

Miniaturization (sub-0.5mm contact pitch research)
High-speed signal optimization (5G/6G compatibility)
Integrated EMI shielding solutions
Advanced plating materials (nanocoatings for corrosion resistance)
Smart connector integration (embedded sensors for predictive maintenance)