Terminals - PC Pin Receptacles, Socket Connectors

Part Number	Description / PDF	Quantity
1-5645953-2 TE Connectivity AMP Connectors	CONN PIN RCPT .020-.026 SOLDER	6840
1147-0-18-15-21-27-10-0 Mill-Max	CONN PIN RCPT .015-.022 PRESSFIT	2139
322-HCS5P3-100 TE Connectivity AMP Connectors	CONN PIN RCPT .016-.021 PRESSFIT	0
712-87-137-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0579-0-15-01-11-27-10-0 Mill-Max	CONN PIN RCPT .015-.020 PRESSFIT	19383
0464-0-15-15-10-27-04-0 Mill-Max	CONN PIN RCPT .012-.017 SOLDER	10226
9372-0-15-15-23-27-10-0 Mill-Max	CONN PIN RCPT .045-.065 SOLDER	40992
5650-0-19-15-16-27-10-0 Mill-Max	CONN RECEPT PIN .022-.034" .295"	5578
3-5331272-9 TE Connectivity AMP Connectors	CONN PIN RCPT .018-.021 SOLDER	0
8579-1-15-01-21-27-10-0 Mill-Max	CONN PIN RCPT .015-.022 SOLDER	12237
0327-0-15-01-34-27-10-0 Mill-Max	CONN PIN RCPT .032-.046 SOLDER	15415
H3155-01 Harwin	CONN PIN RCPT .018-.020 SOLDER	18934
2-5332070-8 TE Connectivity AMP Connectors	CONN PIN RCPT .037-.040 SOLDER	0
0415-0-15-01-16-27-10-0 Mill-Max	CONN PIN RCPT .022-.034 SOLDER	0
0284-0-15-01-16-27-10-0 Mill-Max	CONN PIN RCPT .022-.034 SOLDER	0
6628-0-18-15-18-14-10-0 Mill-Max	CONN PIN RCPT	0
2297-2-17-15-16-27-02-0 Mill-Max	CONN PIN RCPT .022-.034 KNURL	3463
9837-0-15-80-14-27-10-0 Mill-Max	CONN PIN RCPT	7605
712-87-143-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
5-5330808-4 TE Connectivity AMP Connectors	CONN PIN RCPT .010-.013 SOLDER	0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Right-Angle Pin Receptacles	90 orientation for space optimization	Desktop motherboard peripheral connections
Through-Hole Socket Connectors	High mechanical stability with PCB via mounting	Industrial control panel interfaces
High-Density Array Connectors	Miniaturized contacts for compact designs	Smartphone board-to-board connections
Power Pin Receptacles	Heavy-duty contacts for high-current applications	Server power distribution units

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT thermoplastic materials)
Contact springs (phosphor bronze with gold plating)
Polarization keying features
PCB mounting retention mechanisms
EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power handling capacity
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Withstanding Voltage	500V-1kV	Safety isolation requirement
Mating Cycles	500-10,000 cycles	Service life indicator
Operating Temperature	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Computer hardware (motherboards, GPUs)
Telecom infrastructure (5G base stations)
Automotive electronics (ECUs, sensors)
Medical devices (diagnostic equipment)
Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MICRO MATCH Series	0.8mm contact spacing, 3A rating
Amphenol ICC	SmartArray High-Speed Socket	10Gbps data rate capability
Molex	PicoBlade Connector System	Space-saving 1.25mm pitch design
Samtec	SEARAY High-Density Array	Up to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage needs)
Environmental conditions (temperature/humidity range)
Space constraints (board layout limitations)
Service life expectations (maintenance frequency)
Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

Miniaturization (sub-0.5mm contact pitch research)
High-speed signal optimization (5G/6G compatibility)
Integrated EMI shielding solutions
Advanced plating materials (nanocoatings for corrosion resistance)
Smart connector integration (embedded sensors for predictive maintenance)