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Storage & Server IO (Amphenol ICC) |
CONN TERM FOIL STAR CRIMP TIN |
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Storage & Server IO (Amphenol ICC) |
CONN TERM FOIL STAR CRIMP TIN |
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Storage & Server IO (Amphenol ICC) |
CONN TERM FOIL STAR CRIMP TIN |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN TERM FOIL STAR CRIMP TIN |
0 |
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Foil connectors are specialized electrical interconnect solutions designed to establish reliable connections between thin, flexible conductive materials (such as copper or aluminum foils) and other circuit elements. These connectors play a critical role in applications requiring compact designs, high flexibility, and stable electrical performance. Their importance has grown significantly with advancements in flexible electronics, wearable devices, and high-density packaging systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Compression Foil Connectors | Mechanical clamping with high contact uniformity | Flexible printed circuits (FPCs) in smartphones |
| Solderable Foil Connectors | Reflow-solderable design with thermal stability | Automotive sensor modules |
| Adhesive-Bonded Connectors | Conductive adhesive fixation for ultra-thin foils | Medical wearable monitors |
| Edge-Clip Connectors | Zero-insertion-force (ZIF) compliant design | Industrial IoT device arrays |
A typical foil connector system comprises: - Contact Element: Phosphor bronze or beryllium copper with gold/tin plating - Insulation Base: LCP (Liquid Crystal Polymer) or PBT with UL94 V-0 rating - Retention Mechanism: Spring-loaded clips or adhesive polymer layers - Environmental Seal: Optional IP67-rated gaskets for harsh conditions
| Parameter | Typical Range | Importance |
|---|---|---|
| Contact Resistance | 5-20 m | Directly affects power efficiency |
| Current Rating | 0.5-5.0 A | Determines thermal performance |
| Operating Temperature | -55 C to +150 C | Ensures reliability in extreme environments |
| Insertion Force | 0.1-0.8 N/contact | Critical for automated assembly |
| Durability | 500-5000 mating cycles | Impacts product lifespan |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| TE Connectivity | Micro-Foil Series | 0.1mm pitch, 10 Gbps signal integrity |
| Molex | Flexible Interconnect System | Self-aligning guide structures |
| Amphenol | Foil-Lok | Multi-point contact design |
Key considerations include: - Match foil thickness (0.05-0.5mm) to connector cavity dimensions - Verify compliance with IPC-J-STD-001 for solderability - For dynamic applications: Select connectors with strain relief features - High-frequency applications require controlled impedance designs
The market is shifting towards: - Nano-coating technologies for corrosion resistance - Integrated EMI shielding solutions - Development of 0.05mm pitch connectors for AR/VR devices - Adoption of AI-driven contact wear prediction algorithms