Terminal Blocks - Headers, Plugs and Sockets

Image Part Number Description / PDF Quantity Rfq
TJ0511520000G

TJ0511520000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 5POS STR 3.5MM

0

V70402500000G

V70402500000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 4POS VERT 7.62MM

0

VH1951520000G

VH1951520000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 19/38POS 5.08MM

0

VM0355510000G

VM0355510000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 3POS STR 5.08MM

0

OP2222000000G

OP2222000000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 22POS VERT 3.5MM

0

OQ031G01B000G

OQ031G01B000G

Anytek (Amphenol Anytek)

OQ - 3.5- 3P BLACK, LCP THR , PI

0

OQ0354810300G

OQ0354810300G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 3POS 90DEG 5.08MM

0

H51670510000G

H51670510000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 16POS STR 5MM

0

OQ1912010000G

OQ1912010000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 19POS 90DEG 3.5MM

0

KE1272530000G

KE1272530000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 12POS 90DEG 5MM

0

V714A2500000G

V714A2500000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 14POS VERT 7.5MM

0

OQ0400800000G

OQ0400800000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 4POS VERT 7.62MM

0

TT1041500000G

TT1041500000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 10POS 3.81MM

0

VH2151520000G

VH2151520000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 21/42POS 5.08MM

0

H418505B0000G

H418505B0000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 18POS STR 5.08MM

0

KS0202500000G

KS0202500000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 2POS VERT 7.62MM

0

HW0970500000G

HW0970500000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 9POS STR 5MM

0

VF2432500000G

VF2432500000G

Anytek (Amphenol Anytek)

TERM BLOCK HDR 24POS VERT 3.81MM

0

TS09118D0000G

TS09118D0000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 9POS 3.5MM

0

VM2355520000G

VM2355520000G

Anytek (Amphenol Anytek)

TERM BLOCK PLUG 23POS STR 5.08MM

0

Terminal Blocks - Headers, Plugs and Sockets

1. Overview

Terminal blocks, headers, plugs, and sockets are essential components in electrical and electronic systems for establishing reliable connections between circuits. These devices enable signal transmission, power distribution, and system modularity. Their standardized designs ensure interoperability, scalability, and ease of maintenance in complex systems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Terminal Blocks Screw/clamp-based connections for high current/ voltage Industrial control panels, power distribution units
PCB Headers Pin/grid arrays for board-to-board connections Embedded systems, Arduino shields
RJ Connectors Modular jacks for data/telecom signals Ethernet networks (RJ45), telephone systems (RJ11)
D-Sub Connectors Multi-pin trapezoidal shells for analog/digital signals Legacy serial interfaces, industrial sensors
USB Connectors Hot-pluggable interfaces for power/data Consumer electronics, peripheral devices

3. Structure and Components

Typical structures include:

  • Insulating housing (PA66, PBT, or LCP plastics)
  • Contact elements (phosphor bronze, beryllium copper)
  • Plating materials (gold, tin, nickel for corrosion resistance)
  • Actuation mechanisms (screws, spring clamps, or friction fits)
  • EMI shielding layers (for high-frequency applications)

4. Key Technical Specifications

Parameter Importance
Current Rating (A) Determines power handling capacity
Voltage Rating (V) Defines dielectric strength requirements
Contact Resistance (m ) Impacts signal integrity and power loss
Insertion Loss (dB) Critical for high-speed data transmission
Mating Cycles Indicates mechanical durability
Operating Temperature (- C to + C) Defines environmental tolerance

5. Application Fields

Primary industries include:

  • Industrial automation (PLCs, HMIs)
  • Telecommunications (5G base stations, routers)
  • Consumer electronics (smartphones, wearables)
  • Medical equipment (imaging devices, patient monitors)
  • Automotive (EV charging systems, ADAS)

6. Leading Manufacturers and Products

Manufacturer Representative Product
Phoenix Contact COMBICON series terminal blocks
TE Connectivity MICRO MATCH connectors
Molex SL Series headers
Amphenol D-Subminiature connectors
Samtec QTE high-speed socket systems

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • Mechanical constraints (space, vibration)
  • Environmental factors (temperature, humidity)
  • Signal integrity needs (frequency, noise rejection)
  • Cost vs. reliability trade-offs
  • Compliance with standards (IPC, IEC, UL)

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable devices
  • High-speed connectors for 5G/6G ( 25 Gbps)
  • Hybrid connectors integrating power/data
  • Eco-friendly materials (halogen-free, RoHS compliant)
  • Smart connectors with built-in sensors
  • Automotive-grade connectors for EVs

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