| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Aries Electronics, Inc. |
CONN ADAPTER 24PIN DIP TO SOWIC |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER DIP TO 16SOIC |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 32DIP 0.6 |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER DIP TO 40DIP 0.6 |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER SOIC TO 8SOWIC |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 44DIP 0.6 |
0 |
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Aries Electronics, Inc. |
ADAPTER/PANEL QFP TO PGA 144POS |
0 |
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Aries Electronics, Inc. |
DIP-TO-SOWIC ADAPTER |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER DIP TO 28SOIC |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 84PGA |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER 20PLCC TO 16DIP |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER SOIC TO 32DIP 0.6 |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 68PGA |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER SOIC TO 20PLCC |
0 |
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|
Aries Electronics, Inc. |
SOCKET ADAPT SOIC-W TO 18DIP 0.3 |
0 |
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Aries Electronics, Inc. |
SOCKET ADAPTER SOIC TO 10SOWIC |
0 |
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|
Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 28PGA |
0 |
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|
Aries Electronics, Inc. |
SOCKET ADAPTER SSOP TO 20DIP 0.6 |
0 |
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|
Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 28DIP 0.6 |
0 |
|
|
Aries Electronics, Inc. |
SOCKET ADAPTER PLCC TO 32DIP 0.6 |
0 |
|
Sockets for ICs (Integrated Circuits) and transistor adapters are interconnect devices designed to temporarily or permanently mount semiconductor components onto printed circuit boards (PCBs). They enable electrical connectivity, signal transmission, and mechanical support while allowing easy replacement or testing. These components are critical in semiconductor testing, prototyping, and high-reliability systems where frequent component swaps or maintenance are required.
| Type | Functional Features | Application Examples |
|---|---|---|
| DIP Socket | Through-hole mounting, parallel pin alignment | Prototyping boards, legacy IC testing |
| SOP Socket | Surface-mount design for small-outline packages | Consumer electronics, mobile devices |
| QFP Adapter | Quad-flat package compatibility with fine-pitch contacts | Microcontroller units, networking equipment |
| BGA Socket | Ball-grid array interface with high-density contacts | High-performance CPUs, FPGAs testing |
| Transistor Adapter | Package conversion (e.g., TO-220 to DIP) | Power electronics prototyping |
Typical physical structure includes:
- **Contact Terminals**: Phosphor bronze or beryllium copper with gold plating for low resistance
- **Insulation Base**: High-temperature resistant LCP or PPS polymer
- **Retention Mechanism**: Spring-loaded clips or screw terminals
- **Mounting Interface**: Through-hole or surface-mount (SMT) pads
Advanced designs incorporate anti-friction coatings and EMI shielding layers for high-frequency applications.
| Parameter | Description |
|---|---|
| Current Rating | 1-5A per contact (critical for power devices) |
| Contact Resistance | 5-20m (impacts signal integrity) |
| Insulation Resistance | >1G (ensures electrical isolation) |
| Durability | 100-1000 mating cycles (defines service life) |
| Operating Temperature | -55 C to +150 C (determines environmental tolerance) |
Main industries and equipment:
- **Semiconductor Testing**: Automated test equipment (ATE), burn-in systems
- **Consumer Electronics**: Mobile phone PCBAs, IoT module prototyping
- **Industrial Automation**: PLC controllers, motor drives
- **Aerospace**: Avionics systems with line-replaceable units
- **Research & Education**: University lab setups, FPGA development platforms
| Manufacturer | Representative Products |
|---|---|
| Amphenol ICC | QSFP+ cage assemblies for optical transceivers |
| TE Connectivity | MicroQSFP sockets for data centers |
| Samtec | SEAM Series high-speed BGA sockets |
| Molex | PicoBlade transistor adapters |
| Yamaichi Electronics | Fine-pitch QFP sockets for automotive ICs |
Key considerations:
1. Package compatibility (pin count, pitch size)
2. Electrical requirements (current/voltage ratings)
3. Mechanical durability for intended usage cycles
4. PCB mounting type (through-hole vs SMT)
5. Compliance with RoHS/REACH standards
Example: For 0.4mm pitch BGA testing, select sockets with self-aligning guide plates and 0.1m contact resistance.
Future development directions include:
- Miniaturization: 0.3mm pitch and below for advanced packaging
- High-frequency capability: >25Gbps data rates for 5G applications
- Thermal management: Integrated heat dissipation structures
- Surface-mount adoption: Replacing through-hole for automated manufacturing
- Material innovation: Graphene-coated contacts for ultra-low resistance