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Sockets for ICs, Transistors

Image Part Number Description / PDF Quantity Rfq
D01-9972742

D01-9972742

Harwin

CONN SOCKET SIP 27POS GOLD

0
D0824-01

D0824-01

Harwin

CONN IC DIP SOCKET 24POS GOLD

0
D83028B-46R

D83028B-46R

Harwin

CONN SOCKET PLCC 28POS TIN

0
D0824-42

D0824-42

Harwin

CONN IC DIP SOCKET 24POS GOLD

0
D01-9951042

D01-9951042

Harwin

CONN SOCKET SIP 10POS GOLD

0
D01-9971842

D01-9971842

Harwin

CONN SOCKET SIP 18POS GOLD

0
D0820-42

D0820-42

Harwin

CONN IC DIP SOCKET 20POS GOLD

0
D01-9951242

D01-9951242

Harwin

CONN SOCKET SIP 12POS GOLD

0
D83068C-46

D83068C-46

Harwin

CONN SOCKET PLCC 68POS TIN

0
D01-9972542

D01-9972542

Harwin

CONN SOCKET SIP 25POS GOLD

0
D84068B-46

D84068B-46

Harwin

CONN SOCKET PLCC 68POS TIN

0
D95A22-42

D95A22-42

Harwin

CONN IC DIP SOCKET 22POS GOLD

0
D01-9973042

D01-9973042

Harwin

CONN SOCKET SIP 30POS GOLD

0
D0814-42

D0814-42

Harwin

CONN IC DIP SOCKET 14POS GOLD

0
D01-9501842

D01-9501842

Harwin

CONN SOCKET SIP 18POS GOLD

0
D83020C-46

D83020C-46

Harwin

CONN SOCKET PLCC 20POS TIN

0
D01-9501442

D01-9501442

Harwin

CONN SOCKET SIP 14POS GOLD

0
D3920-42

D3920-42

Harwin

CONN IC DIP SOCKET 20POS GOLD

0
D2632-42

D2632-42

Harwin

CONN IC DIP SOCKET 32POS GOLD

0
D01-9972442

D01-9972442

Harwin

CONN SOCKET SIP 24POS GOLD

0

Sockets for ICs, Transistors

1. Overview

Sockets for ICs (Integrated Circuits) and transistors are precision-engineered electromechanical components designed to establish reliable electrical connections between semiconductor devices and printed circuit boards (PCBs). They enable signal transmission, power distribution, and thermal management while allowing for easy replacement or upgrading of components. These sockets play a critical role in modern electronics by supporting miniaturization, high-speed data transfer, and thermal stability in applications ranging from consumer devices to aerospace systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
BGA SocketsBall Grid Array compatibility, high pin counts, low inductanceHigh-performance computing (HPC), servers
LGA SocketsLand Grid Array interface, direct die contact, thermal dissipationCPU sockets in desktop/server motherboards
DIP SocketsDual In-line Package support, through-hole mountingLegacy industrial control systems
Power Transistor SocketsHigh-current capacity, thermal management featuresElectric vehicle (EV) powertrains, industrial motors
RF Transistor SocketsImpedance-matched design, EMI shielding5G base stations, microwave communication

3. Structure and Components

Typical construction includes:

  • Contact Elements: Phosphor bronze or beryllium copper with gold-plated surfaces for low resistance
  • Insulation Body: High-temperature resistant LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide)
  • Actuation Mechanism: Zero Insertion Force (ZIF) levers or compression mounts
  • Thermal Features: Integrated heat spreaders or thermal vias in high-power variants

4. Key Technical Specifications

ParameterImportance
Current Rating (A)Determines power handling capacity (1-500A range)
Contact Resistance (m )Impacts signal integrity and thermal performance
Durability (Insertion Cycles)Defines service life (100-10,000+ cycles)
Thermal Resistance ( C/W)Crucial for power device cooling
Frequency Bandwidth (GHz)Limits high-speed signal transmission capability

5. Application Fields

  • Consumer Electronics: Smartphones (RF transistor sockets), laptops (BGA CPU sockets)
  • Automotive: EV battery management systems (power transistor sockets)
  • Telecommunications: 5G massive MIMO arrays (high-frequency transistor sockets)
  • Industrial: CNC machine controllers (high-reliability IC sockets)
  • Aerospace: Avionics systems (high-vibration-tolerant LGA sockets)

6. Leading Manufacturers and Products

ManufacturerHeadquartersRepresentative Products
Amphenol ICCUSASmartSpring BGA sockets for AI accelerators
MolexUSAImpact LGA sockets with integrated cooling
TE ConnectivitySwitzerlandDynamic MX DIP sockets for industrial controls
Yamaichi ElectronicsJapanHFBR-4541 RF transistor sockets for 5G
SamtecUSAQ Strip power transistor sockets with 150A capacity

7. Selection Recommendations

Key considerations:

  • Match socket type to package format (BGA/LGA/DIP)
  • Verify current/voltage ratings exceed system requirements
  • Evaluate thermal management needs for power devices
  • Select appropriate durability level for maintenance plans
  • Consider ZIF mechanisms for prototyping applications

Case Study: For EV inverter systems, select power transistor sockets with >200A rating, 0.5 C/W thermal resistance, and automotive-grade vibration resistance.

8. Industry Trends

Emerging directions include:

  • Miniaturization: 0.4mm pitch BGA sockets for mobile SoCs
  • High-frequency optimization: Sockets supporting 112Gbps PAM4 signaling
  • Thermal integration: Active cooling channels within socket structures
  • Material innovation: Graphene-enhanced contact coatings for 50% lower resistance
  • Smart sockets: Embedded sensors for real-time thermal/electrical monitoring
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