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Sockets for ICs, Transistors

Image Part Number Description / PDF Quantity Rfq
1050281001

1050281001

Woodhead - Molex

CONN CAM SOCKET 32POS GOLD

2147483647
1051420132

1051420132

Woodhead - Molex

CONN SOCKET LGA 2011POS GOLD

211
1051420133

1051420133

Woodhead - Molex

CONN SOCKET LGA 2011POS GOLD

0
1051900001

1051900001

Woodhead - Molex

TOP-MOUNT CAMERA SOCKET FOR SMIA

0
1052000001

1052000001

Woodhead - Molex

SMIA55 CAMERA SOCKET BOTTOM CONT

0
1051631001

1051631001

Woodhead - Molex

SMIA65 CAMERA SOCKET CONTACT

0
1051420433

1051420433

Woodhead - Molex

CONN SOCKET LGA 2011POS GOLD

0
0010182031

0010182031

Woodhead - Molex

CONN SOCKET TRANSIST TO-220 3POS

0
0475940001

0475940001

Woodhead - Molex

CONN SOCKET LGA 1366POS GOLD

0
0475940002

0475940002

Woodhead - Molex

CONN SOCKET LGA 1366POS GOLD

0
0475939000

0475939000

Woodhead - Molex

CONN SOCKET LGA 1366POS NICKEL

0
0009483031

0009483031

Woodhead - Molex

CONN SOCKET TRANSIST TO-220 3POS

0
0475943001

0475943001

Woodhead - Molex

CONN SOCKET LGA 1356POS GOLD

0
0473370001

0473370001

Woodhead - Molex

CONN CAM SOCKET 24POS GOLD

0
0479890132

0479890132

Woodhead - Molex

CONN SOCKET PGA 989POS GOLD

0
0479890222

0479890222

Woodhead - Molex

CONN SOCKET PGA 989POS GOLD

0
0479890242

0479890242

Woodhead - Molex

CONN SOCKET PGA 988POS GOLD

0
0475962032

0475962032

Woodhead - Molex

CONN SOCKET LGA 1155POS

0
1050282031

1050282031

Woodhead - Molex

CONN CAMERA SOCKET 32POS GOLD

0
0479890232

0479890232

Woodhead - Molex

CONN SOCKET PGA 989POS GOLD

0

Sockets for ICs, Transistors

1. Overview

Sockets for ICs (Integrated Circuits) and transistors are precision-engineered electromechanical components designed to establish reliable electrical connections between semiconductor devices and printed circuit boards (PCBs). They enable signal transmission, power distribution, and thermal management while allowing for easy replacement or upgrading of components. These sockets play a critical role in modern electronics by supporting miniaturization, high-speed data transfer, and thermal stability in applications ranging from consumer devices to aerospace systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
BGA SocketsBall Grid Array compatibility, high pin counts, low inductanceHigh-performance computing (HPC), servers
LGA SocketsLand Grid Array interface, direct die contact, thermal dissipationCPU sockets in desktop/server motherboards
DIP SocketsDual In-line Package support, through-hole mountingLegacy industrial control systems
Power Transistor SocketsHigh-current capacity, thermal management featuresElectric vehicle (EV) powertrains, industrial motors
RF Transistor SocketsImpedance-matched design, EMI shielding5G base stations, microwave communication

3. Structure and Components

Typical construction includes:

  • Contact Elements: Phosphor bronze or beryllium copper with gold-plated surfaces for low resistance
  • Insulation Body: High-temperature resistant LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide)
  • Actuation Mechanism: Zero Insertion Force (ZIF) levers or compression mounts
  • Thermal Features: Integrated heat spreaders or thermal vias in high-power variants

4. Key Technical Specifications

ParameterImportance
Current Rating (A)Determines power handling capacity (1-500A range)
Contact Resistance (m )Impacts signal integrity and thermal performance
Durability (Insertion Cycles)Defines service life (100-10,000+ cycles)
Thermal Resistance ( C/W)Crucial for power device cooling
Frequency Bandwidth (GHz)Limits high-speed signal transmission capability

5. Application Fields

  • Consumer Electronics: Smartphones (RF transistor sockets), laptops (BGA CPU sockets)
  • Automotive: EV battery management systems (power transistor sockets)
  • Telecommunications: 5G massive MIMO arrays (high-frequency transistor sockets)
  • Industrial: CNC machine controllers (high-reliability IC sockets)
  • Aerospace: Avionics systems (high-vibration-tolerant LGA sockets)

6. Leading Manufacturers and Products

ManufacturerHeadquartersRepresentative Products
Amphenol ICCUSASmartSpring BGA sockets for AI accelerators
MolexUSAImpact LGA sockets with integrated cooling
TE ConnectivitySwitzerlandDynamic MX DIP sockets for industrial controls
Yamaichi ElectronicsJapanHFBR-4541 RF transistor sockets for 5G
SamtecUSAQ Strip power transistor sockets with 150A capacity

7. Selection Recommendations

Key considerations:

  • Match socket type to package format (BGA/LGA/DIP)
  • Verify current/voltage ratings exceed system requirements
  • Evaluate thermal management needs for power devices
  • Select appropriate durability level for maintenance plans
  • Consider ZIF mechanisms for prototyping applications

Case Study: For EV inverter systems, select power transistor sockets with >200A rating, 0.5 C/W thermal resistance, and automotive-grade vibration resistance.

8. Industry Trends

Emerging directions include:

  • Miniaturization: 0.4mm pitch BGA sockets for mobile SoCs
  • High-frequency optimization: Sockets supporting 112Gbps PAM4 signaling
  • Thermal integration: Active cooling channels within socket structures
  • Material innovation: Graphene-enhanced contact coatings for 50% lower resistance
  • Smart sockets: Embedded sensors for real-time thermal/electrical monitoring
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