Sockets for ICs, Transistors

Part Number	Description / PDF	Quantity
32-6554-10 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 32POS TIN	495
08-3518-10 Aries Electronics, Inc.	CONN IC DIP SOCKET 8POS GOLD	1799
18-8400-610C Aries Electronics, Inc.	CONN IC DIP SOCKET 18POS GOLD	0
40-0518-11 Aries Electronics, Inc.	CONN SOCKET SIP 40POS GOLD	232
22-4518-11 Aries Electronics, Inc.	CONN IC DIP SOCKET 22POS GOLD	8
48-6574-10 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 48POS GLD	0
50-9518-10 Aries Electronics, Inc.	CONN IC DIP SOCKET 50POS GOLD	0
07-0513-10 Aries Electronics, Inc.	CONN SOCKET SIP 7POS GOLD	73
28-6518-101 Aries Electronics, Inc.	CONN IC DIP SOCKET 28POS GOLD	0
10-2822-90 Aries Electronics, Inc.	CONN IC DIP SOCKET 10POS GOLD	15
16-0518-00 Aries Electronics, Inc.	CONN SOCKET SIP 16POS GOLD	27
10-2513-10H Aries Electronics, Inc.	CONN IC DIP SOCKET 10POS GOLD	0
40-6574-11 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 40POS TIN	0
10-9513-10T Aries Electronics, Inc.	CONN IC DIP SOCKET 10POS GOLD	0
08-3518-00 Aries Electronics, Inc.	CONN IC DIP SOCKET 8POS GOLD	4387
14-810-90 Aries Electronics, Inc.	CONN IC DIP SOCKET 14POS GOLD	855
32-6574-10 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 32POS TIN	0
40-526-10 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 40POS TIN	311
28-6574-10 Aries Electronics, Inc.	CONN IC DIP SOCKET ZIF 28POS TIN	3
84-537-21 Aries Electronics, Inc.	CONN SOCKET PLCC ZIF 84POS GOLD	3

Sockets for ICs, Transistors

1. Overview

Sockets for ICs (Integrated Circuits) and transistors are precision-engineered electromechanical components designed to establish reliable electrical connections between semiconductor devices and printed circuit boards (PCBs). They enable signal transmission, power distribution, and thermal management while allowing for easy replacement or upgrading of components. These sockets play a critical role in modern electronics by supporting miniaturization, high-speed data transfer, and thermal stability in applications ranging from consumer devices to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
BGA Sockets	Ball Grid Array compatibility, high pin counts, low inductance	High-performance computing (HPC), servers
LGA Sockets	Land Grid Array interface, direct die contact, thermal dissipation	CPU sockets in desktop/server motherboards
DIP Sockets	Dual In-line Package support, through-hole mounting	Legacy industrial control systems
Power Transistor Sockets	High-current capacity, thermal management features	Electric vehicle (EV) powertrains, industrial motors
RF Transistor Sockets	Impedance-matched design, EMI shielding	5G base stations, microwave communication

3. Structure and Components

Typical construction includes:

Contact Elements: Phosphor bronze or beryllium copper with gold-plated surfaces for low resistance
Insulation Body: High-temperature resistant LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide)
Actuation Mechanism: Zero Insertion Force (ZIF) levers or compression mounts
Thermal Features: Integrated heat spreaders or thermal vias in high-power variants

4. Key Technical Specifications

Parameter	Importance
Current Rating (A)	Determines power handling capacity (1-500A range)
Contact Resistance (m )	Impacts signal integrity and thermal performance
Durability (Insertion Cycles)	Defines service life (100-10,000+ cycles)
Thermal Resistance ( C/W)	Crucial for power device cooling
Frequency Bandwidth (GHz)	Limits high-speed signal transmission capability

5. Application Fields

Consumer Electronics: Smartphones (RF transistor sockets), laptops (BGA CPU sockets)
Automotive: EV battery management systems (power transistor sockets)
Telecommunications: 5G massive MIMO arrays (high-frequency transistor sockets)
Industrial: CNC machine controllers (high-reliability IC sockets)
Aerospace: Avionics systems (high-vibration-tolerant LGA sockets)

6. Leading Manufacturers and Products

Manufacturer	Headquarters	Representative Products
Amphenol ICC	USA	SmartSpring BGA sockets for AI accelerators
Molex	USA	Impact LGA sockets with integrated cooling
TE Connectivity	Switzerland	Dynamic MX DIP sockets for industrial controls
Yamaichi Electronics	Japan	HFBR-4541 RF transistor sockets for 5G
Samtec	USA	Q Strip power transistor sockets with 150A capacity

7. Selection Recommendations

Key considerations:

Match socket type to package format (BGA/LGA/DIP)
Verify current/voltage ratings exceed system requirements
Evaluate thermal management needs for power devices
Select appropriate durability level for maintenance plans
Consider ZIF mechanisms for prototyping applications

Case Study: For EV inverter systems, select power transistor sockets with >200A rating, 0.5 C/W thermal resistance, and automotive-grade vibration resistance.

8. Industry Trends

Emerging directions include:

Miniaturization: 0.4mm pitch BGA sockets for mobile SoCs
High-frequency optimization: Sockets supporting 112Gbps PAM4 signaling
Thermal integration: Active cooling channels within socket structures
Material innovation: Graphene-enhanced contact coatings for 50% lower resistance
Smart sockets: Embedded sensors for real-time thermal/electrical monitoring