| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD |
0 |
|
 |
Mill-Max |
CONN IC DIP SOCKET 18POS GOLD |
0 |
|
 |
Preci-Dip |
CONN ZIG-ZAG 20POS GOLD |
0 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD |
0 |
|
 |
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS TIN |
1195 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD |
0 |
|
 |
Omron Electronics Components |
CONN IC DIP SOCKET 32POS GOLD |
0 |
|
 |
3M |
CONN SOCKET SOIC 16POS GOLD |
29 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD |
0 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 36POS GOLD |
0 |
|
 |
Samtec, Inc. |
CONN IC DIP SOCKET 40POS GOLD |
133 |
|
 |
On-Shore Technology, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
1 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD |
0 |
|
 |
Mill-Max |
CONN IC DIP SOCKET 68POS GOLD |
6 |
|
 |
Mill-Max |
CONN IC DIP SOCKET 8POS GOLD |
0 |
|
 |
ASSMANN WSW Components |
CONN SOCKET PLCC 28POS TIN |
6981617 |
|
 |
On-Shore Technology, Inc. |
CONN SOCKET PLCC 28POS |
1 |
|
 |
Omron Electronics Components |
CONN IC DIP SOCKET 24POS GOLD |
0 |
|
 |
Aries Electronics, Inc. |
CONN IC DIP SOCKET 28POS GOLD |
213 |
|
 |
Preci-Dip |
CONN IC DIP SOCKET 40POS GOLD |
440 |
|
Sockets for ICs (Integrated Circuits) and transistors are precision-engineered electromechanical components designed to establish reliable electrical connections between semiconductor devices and printed circuit boards (PCBs). They enable signal transmission, power distribution, and thermal management while allowing for easy replacement or upgrading of components. These sockets play a critical role in modern electronics by supporting miniaturization, high-speed data transfer, and thermal stability in applications ranging from consumer devices to aerospace systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| BGA Sockets | Ball Grid Array compatibility, high pin counts, low inductance | High-performance computing (HPC), servers |
| LGA Sockets | Land Grid Array interface, direct die contact, thermal dissipation | CPU sockets in desktop/server motherboards |
| DIP Sockets | Dual In-line Package support, through-hole mounting | Legacy industrial control systems |
| Power Transistor Sockets | High-current capacity, thermal management features | Electric vehicle (EV) powertrains, industrial motors |
| RF Transistor Sockets | Impedance-matched design, EMI shielding | 5G base stations, microwave communication |
Typical construction includes:
| Parameter | Importance |
|---|---|
| Current Rating (A) | Determines power handling capacity (1-500A range) |
| Contact Resistance (m ) | Impacts signal integrity and thermal performance |
| Durability (Insertion Cycles) | Defines service life (100-10,000+ cycles) |
| Thermal Resistance ( C/W) | Crucial for power device cooling |
| Frequency Bandwidth (GHz) | Limits high-speed signal transmission capability |
| Manufacturer | Headquarters | Representative Products |
|---|---|---|
| Amphenol ICC | USA | SmartSpring BGA sockets for AI accelerators |
| Molex | USA | Impact LGA sockets with integrated cooling |
| TE Connectivity | Switzerland | Dynamic MX DIP sockets for industrial controls |
| Yamaichi Electronics | Japan | HFBR-4541 RF transistor sockets for 5G |
| Samtec | USA | Q Strip power transistor sockets with 150A capacity |
Key considerations:
Case Study: For EV inverter systems, select power transistor sockets with >200A rating, 0.5 C/W thermal resistance, and automotive-grade vibration resistance.
Emerging directions include: