Shunts, Jumpers

Image	Part Number	Description / PDF	Quantity	Rfq
	69144-216LF Storage & Server IO (Amphenol ICC)	CONN SHUNT	0
	65474-005 Storage & Server IO (Amphenol ICC)	MINI JUMP 2POS .100"	0
	999-11-220-11-000000 Mill-Max	JUMPER INSULATED MALE .200" RED	0
	BTMM-115-01-T-S Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	MS2H-2-T Adam Tech	MINI SHUNT 2.0MM 2P PULL HANDLE	0
	BTMM-116-01-T-D Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	66971-102 Storage & Server IO (Amphenol ICC)	CONN SHUNT	0
	BTMM-108-01-T-D Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	65474-005LF Storage & Server IO (Amphenol ICC)	MINI JUMP 2POS .100"	0
	BTMM-106-01-T-D-002 Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	S2711-06 Harwin	JUMPER TIN SMD	0
	208387002001801+ KYOCERA Corporation	CONN HEADER	0
	BTMM-124-01-T-D Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	SNT-100-RD-H-H Samtec, Inc.	SHUNT JUMPERS	0
	D3081-01 Harwin	1MM SHORTING LINK	0
	D3081-46 Harwin	SHORTING LINK 1MM	0
	69145-316 Storage & Server IO (Amphenol ICC)	JUMPER LOW PRO DR MULTI	0
	BTMM-128-01-T-S Samtec, Inc.	.020 SQ. RA POST ASSEMBLY	0
	S1621F06 Harwin	JUMPER SMD	0
	76113-102 Storage & Server IO (Amphenol ICC)	JUMPER	0

Shunts, Jumpers

1. Overview

Connectors, interconnects, shunts, and jumpers are fundamental components in electronic and electrical systems. Connectors enable separable electrical connections, interconnects provide permanent or semi-permanent wiring solutions, shunts allow controlled current diversion, and jumpers create configurable circuit paths. These components play critical roles in system flexibility, maintenance, and performance across industries such as telecommunications, automotive, and industrial automation.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Connectors	Line/receptacle interfaces with mechanical coupling	RJ45 for Ethernet, USB Type-C for consumer devices
Interconnects	Fixed wiring assemblies with terminations	PCB-to-PCB ribbon cables in servers
Shunts	Low-resistance paths for current measurement or bypass	Power supply current monitoring circuits
Jumpers	Manual configuration switches using conductive bridges	BIOS configuration on motherboards

3. Structure and Composition

Connectors typically consist of contact pins (phosphor bronze with gold plating), insulating housings (LCP or nylon), and shielding (nickel-plated brass). Shunts use manganin alloy elements with tin/copper terminals for low TCR. Jumpers employ PBT resin bodies with phosphor bronze contacts. Interconnects combine stranded copper conductors with PVC/LSZH insulation in ribbon or round cable configurations.

4. Key Technical Parameters

Parameter	Importance	Typical Values
Current Rating	Determines power handling capability	0.5A-300A
Contact Resistance	Impacts signal integrity and power loss	1-50m
Dielectric Strength	Safety isolation between contacts	500V-5kV
Insertion Loss	Critical for high-frequency signal transmission	0.1-3.0dB
Temperature Range	Environmental operating limits	-55 C to +125 C

5. Application Fields

Telecommunications: 5G base stations, fiber optic cross-connects
Automotive: CAN bus systems, battery management jumpers
Industrial: PLC interconnect cabling, motor drive shunts
Consumer Electronics: Wearable device connectors, PCB jumpers
Renewable Energy: Solar inverter DC shunts, wind turbine slip rings

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specialization
Amphenol	RADIAL-Lok circular connectors	Aerospace & military applications
TE Connectivity	MULTIGIG backplane connectors	High-speed data centers
Bourns	CSM Series current sense shunts	Power electronics monitoring
Molex	SL Series wire-to-board jumpers	Automotive control systems

7. Selection Recommendations

Current/Voltage Requirements: Select ratings with 20% safety margin
Environmental Factors: Consider corrosion resistance for marine applications
Space Constraints: Use SMD jumpers for high-density PCB layouts
Signal Integrity: Choose controlled impedance connectors for >1Gbps signals
Certifications: Ensure compliance with UL/CSA/IEC standards

8. Industry Trends

Key developments include: miniaturization (0.4mm pitch connectors), high-speed signal transmission (56Gbps+ backplane connectors), smart shunts with integrated sensors, and eco-friendly materials meeting RoHS/REACH. The rise of electric vehicles is driving demand for high-voltage interconnect systems, while 5G infrastructure requires connectors with improved EMI shielding. Programmable electronic jumpers are emerging as alternatives to physical hardware configuration.