Rectangular Connectors - Housings

Image Part Number Description / PDF Quantity Rfq
PNDP-18V-Z

PNDP-18V-Z

JST

CONN HOUSING PND 2MM 18POS DUAL

0

PNDP-22V-Z

PNDP-22V-Z

JST

CONN HOUSING PND 2MM 22POS DUAL

0

H24P-SHF-AA

H24P-SHF-AA

JST

CONN RECEPT HOUSING 24POS NH

0

J21DPM-20V-KY

J21DPM-20V-KY

JST

CONN TAB HOUSING 20POS Y-KEY

0

RA-2611

RA-2611

JST

CONN RECEPT HOUSING 26POS RA

0

J21DF-12V-KY

J21DF-12V-KY

JST

CONN RECEPT HOUSING 12POS Y-KEY

0

ZHR-2-E

ZHR-2-E

JST

CONN HOUSING ZH 2POS 1.5MM BLU

0

RA-1011

RA-1011

JST

CONN RECEPT HOUSING 10POS RA

0

NVAR-02VS

NVAR-02VS

JST

CONN SOCKET 2POS 7.92MM WHITE

0

RA-1611

RA-1611

JST

CONN RECEPT HOUSING 16POS RA

0

BHTR-02VS

BHTR-02VS

JST

CONN RCPT HSG 2POS 5.10MM

0

XAGRP-051-K

XAGRP-051-K

JST

CONN HOUSING XAG 5POS 2.5MM CRIM

0

ZHR-2-K

ZHR-2-K

JST

CONN HOUSING ZH 2POS 1.5MM BLK

0

GHDR-40V-S(F)

GHDR-40V-S(F)

JST

CONN HOUSING GHD 40POS DL 1.25MM

0

XMP-06V

XMP-06V

JST

WIRE TO WIRE CONN

0

H8P-SHF-AA

H8P-SHF-AA

JST

CONN RECEPT HOUSING 8POS NH

0

H18P-SHF-AA

H18P-SHF-AA

JST

CONN RECEPT HOUSING 18POS NH

0

HLR-08V

HLR-08V

JST

CONN RECEPT 8 POS 3.96MM PITCH

0

GHDR-30V-S(F)

GHDR-30V-S(F)

JST

CONN HOUSING GHD 30POS DL 1.25MM

0

ELR-03V

ELR-03V

JST

CONN HOUSING EL 3POS 4.5MM

0

Rectangular Connectors - Housings

1. Overview

Rectangular connectors - housings are critical components in electrical and electronic systems, serving as mechanical enclosures for contact arrays and providing alignment and protection for mating interfaces. Defined by their standardized rectangular cross-sections, these housings enable reliable signal and power transmission across diverse applications. Their importance in modern technology lies in their ability to standardize connectivity solutions while supporting miniaturization, high-speed data transfer, and harsh-environment performance in industries ranging from telecommunications to automotive systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Single-row HousingsCompact design with one linear contact arrayConsumer electronics internal connectors
Double-row HousingsParallel contact arrangement for higher densityIndustrial control panels and PLCs
High-density HousingsMiniaturized contacts with pitch 1.27mmTelecom backplanes and server racks
Waterproof HousingsIP67+ rated sealing with gaskets/O-ringsOutdoor EV charging stations
Modular HousingsCustomizable insert configurationsMultifunctional industrial equipment

3. Structure and Components

Typical housing assemblies consist of:

  • Insulating body (LCP/PBT thermoplastics) with precise contact cavities
  • Integral polarization keys to prevent mis-mating
  • Integrated latch mechanisms (positive/negative locks)
  • Sealing interfaces (for IP-rated variants)
  • PCB mounting features (through-hole/SMT terminations)
Contact retention systems use beam-type spring contacts with gold-plated phosphor bronze alloys, while environmental seals employ silicone rubber gaskets.

4. Key Technical Specifications

ParameterImportance
Rated Voltage (50-600V)Determines dielectric strength and application safety
Current Rating (1-40A)Defines power transmission capacity
Contact Resistance ( 10m )Impacts signal integrity and power loss
Insulation Resistance ( 10G )Ensures electrical isolation between circuits
Operating Temperature (-55 C to +150 C)Dictates environmental suitability
IP Rating (IP20-IP69K)Specifies protection against solids/liquids
Mechanical Life (500-10,000 cycles)Indicates durability for frequent mating

5. Application Fields

Primary industry applications include:

  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC I/O interfaces, sensor/actuator connections
  • Automotive: EV battery management systems, ADAS connectors
  • Medical Equipment: Diagnostic imaging device interfaces
  • Consumer Electronics: Laptop power/data hybrid connectors
Case Study: TE Connectivity's AMPMODU series enables modular connectivity in factory automation systems, supporting rapid replacement of sensors and valves without rewiring.

6. Leading Manufacturers and Products

ManufacturerRepresentative Product Series
TE ConnectivityAMPMODU, CONSENT
Amphenol ICCEB15, CPC12
MolexMicro-Fit 3.0, MX150
Delphi ElectronicsGT Advanced, Metri-Pack 150
JAE ElectronicsDF11, MX64

7. Selection Recommendations

Key selection criteria:

  1. Determine current/voltage requirements with 20% safety margin
  2. Match contact pitch (2.54mm standard, 0.8mm for HDI applications)
  3. Select appropriate locking mechanism (latch/screw types for vibration environments)
  4. Verify material compliance (UL94 V-0 rated for flammability)
  5. Assess environmental requirements (temperature, humidity, chemical exposure)
  6. Evaluate termination compatibility (wire gauge range for crimp versions)
Prioritize suppliers with global footprint for volume production support.

8. Industry Trends

Key development directions:

  • Miniaturization: Sub-1mm pitch solutions for mobile devices
  • High-speed capability: Differential pair designs for 25+ Gbps data rates
  • Eco-friendly materials: Halogen-free thermoplastics adoption
  • Smart integration: Embedded sensors for condition monitoring
  • Standardization: Universal designs per IEC 60603-7 series
The global market is projected to grow at 6.2% CAGR through 2027, driven by electric vehicle and 5G infrastructure demands.

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