Rectangular Connectors

Rectangular Connectors - Housings

Part Number	Description / PDF	Quantity
PQ50S-48P(01) Hirose	CONN HDR	0
DF51K-6S-2C(800) Hirose	CONN RCPT 2MM SNGL 6POS	157
A4B-10S-2C Hirose	CONN 2MM HOUSING 10 POS SINGLE	0
EM35MRA-4PC Hirose	CONN RCPT 4POS MALE PNL MNT	0
DF11-20DS-2C(20) Hirose	CONN SOCKET 20POS 2MM CRIMP	1065
DF62P-13EP-2.2C(10) Hirose	CONN PLUG HOUSING 13POS 2.2MM	188
DF11-22DS-2C(20) Hirose	CONN SOCKET 22POS 2MM DUAL CRIMP	0
DF50A-9S-1C Hirose	CONN SOCKET 9POS 1MM CRIMP	0
DF13-13S-1.25C Hirose	CONN SOCKET HOUSING 13POS 1.25MM	90
DF13-10DS-1.25C Hirose	CONN SOCKET HOUSING 10POS 1.25MM	3038
DF22CR-3S-7.92C Hirose	CONN SOCKET 3POS 7.92MM	0
DF13-10S-1.25C Hirose	CONN SOCKET HOUSING 10POS 1.25MM	4043
DF3AA-11EP-2C Hirose	CONN PLUG HOUSING 11POS 2MM	0
DF62B-6EP-2.2C(10) Hirose	CONN PLUG HOUSING 6POS WHT	83
DF51K-4DS-2C(800) Hirose	CONN RCPT 2MM DUAL 4POS	565
DF62B-7S-2.2C Hirose	CONN RECEPT HOUSING 7POS WHT	0
DF60-1EP-10.16C Hirose	CONN HDR 1POS INLINE	254
DF11-24DEP-2C Hirose	CONN PLUG HOUSING 24POS 2MM	41
DF22C-3S-7.92C Hirose	CONN SOCKET 3POS 7.92MM	0
HIF3BA-40D-2.54C(63) Hirose	CONN SOCKET 40POS 2.54MM	0

Rectangular Connectors - Housings

1. Overview

Rectangular connectors - housings are critical components in electrical and electronic systems, serving as mechanical enclosures for contact arrays and providing alignment and protection for mating interfaces. Defined by their standardized rectangular cross-sections, these housings enable reliable signal and power transmission across diverse applications. Their importance in modern technology lies in their ability to standardize connectivity solutions while supporting miniaturization, high-speed data transfer, and harsh-environment performance in industries ranging from telecommunications to automotive systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-row Housings	Compact design with one linear contact array	Consumer electronics internal connectors
Double-row Housings	Parallel contact arrangement for higher density	Industrial control panels and PLCs
High-density Housings	Miniaturized contacts with pitch 1.27mm	Telecom backplanes and server racks
Waterproof Housings	IP67+ rated sealing with gaskets/O-rings	Outdoor EV charging stations
Modular Housings	Customizable insert configurations	Multifunctional industrial equipment

3. Structure and Components

Typical housing assemblies consist of:

Insulating body (LCP/PBT thermoplastics) with precise contact cavities
Integral polarization keys to prevent mis-mating
Integrated latch mechanisms (positive/negative locks)
Sealing interfaces (for IP-rated variants)
PCB mounting features (through-hole/SMT terminations)

Contact retention systems use beam-type spring contacts with gold-plated phosphor bronze alloys, while environmental seals employ silicone rubber gaskets.

4. Key Technical Specifications

Parameter	Importance
Rated Voltage (50-600V)	Determines dielectric strength and application safety
Current Rating (1-40A)	Defines power transmission capacity
Contact Resistance ( 10m )	Impacts signal integrity and power loss
Insulation Resistance ( 10G )	Ensures electrical isolation between circuits
Operating Temperature (-55 C to +150 C)	Dictates environmental suitability
IP Rating (IP20-IP69K)	Specifies protection against solids/liquids
Mechanical Life (500-10,000 cycles)	Indicates durability for frequent mating

5. Application Fields

Primary industry applications include:

Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC I/O interfaces, sensor/actuator connections
Automotive: EV battery management systems, ADAS connectors
Medical Equipment: Diagnostic imaging device interfaces
Consumer Electronics: Laptop power/data hybrid connectors

Case Study: TE Connectivity's AMPMODU series enables modular connectivity in factory automation systems, supporting rapid replacement of sensors and valves without rewiring.

6. Leading Manufacturers and Products

Manufacturer	Representative Product Series
TE Connectivity	AMPMODU, CONSENT
Amphenol ICC	EB15, CPC12
Molex	Micro-Fit 3.0, MX150
Delphi Electronics	GT Advanced, Metri-Pack 150
JAE Electronics	DF11, MX64

7. Selection Recommendations

Key selection criteria:

Determine current/voltage requirements with 20% safety margin
Match contact pitch (2.54mm standard, 0.8mm for HDI applications)
Select appropriate locking mechanism (latch/screw types for vibration environments)
Verify material compliance (UL94 V-0 rated for flammability)
Assess environmental requirements (temperature, humidity, chemical exposure)
Evaluate termination compatibility (wire gauge range for crimp versions)

Prioritize suppliers with global footprint for volume production support.

8. Industry Trends

Key development directions:

Miniaturization: Sub-1mm pitch solutions for mobile devices
High-speed capability: Differential pair designs for 25+ Gbps data rates
Eco-friendly materials: Halogen-free thermoplastics adoption
Smart integration: Embedded sensors for condition monitoring
Standardization: Universal designs per IEC 60603-7 series

The global market is projected to grow at 6.2% CAGR through 2027, driven by electric vehicle and 5G infrastructure demands.