1. Overview

Rectangular connectors - housings are critical components in electrical and electronic systems, serving as mechanical enclosures for contact arrays and providing alignment and protection for mating interfaces. Defined by their standardized rectangular cross-sections, these housings enable reliable signal and power transmission across diverse applications. Their importance in modern technology lies in their ability to standardize connectivity solutions while supporting miniaturization, high-speed data transfer, and harsh-environment performance in industries ranging from telecommunications to automotive systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-row Housings	Compact design with one linear contact array	Consumer electronics internal connectors
Double-row Housings	Parallel contact arrangement for higher density	Industrial control panels and PLCs
High-density Housings	Miniaturized contacts with pitch 1.27mm	Telecom backplanes and server racks
Waterproof Housings	IP67+ rated sealing with gaskets/O-rings	Outdoor EV charging stations
Modular Housings	Customizable insert configurations	Multifunctional industrial equipment

3. Structure and Components

Typical housing assemblies consist of:

• Insulating body (LCP/PBT thermoplastics) with precise contact cavities
• Integral polarization keys to prevent mis-mating
• Integrated latch mechanisms (positive/negative locks)
• Sealing interfaces (for IP-rated variants)
• PCB mounting features (through-hole/SMT terminations)

Contact retention systems use beam-type spring contacts with gold-plated phosphor bronze alloys, while environmental seals employ silicone rubber gaskets.

4. Key Technical Specifications

Parameter	Importance
Rated Voltage (50-600V)	Determines dielectric strength and application safety
Current Rating (1-40A)	Defines power transmission capacity
Contact Resistance ( 10m )	Impacts signal integrity and power loss
Insulation Resistance ( 10G )	Ensures electrical isolation between circuits
Operating Temperature (-55 C to +150 C)	Dictates environmental suitability
IP Rating (IP20-IP69K)	Specifies protection against solids/liquids
Mechanical Life (500-10,000 cycles)	Indicates durability for frequent mating

5. Application Fields

Primary industry applications include:

• Telecommunications: 5G base stations, optical network terminals
• Industrial Automation: PLC I/O interfaces, sensor/actuator connections
• Automotive: EV battery management systems, ADAS connectors
• Medical Equipment: Diagnostic imaging device interfaces
• Consumer Electronics: Laptop power/data hybrid connectors

Case Study: TE Connectivity's AMPMODU series enables modular connectivity in factory automation systems, supporting rapid replacement of sensors and valves without rewiring.

6. Leading Manufacturers and Products

Manufacturer	Representative Product Series
TE Connectivity	AMPMODU, CONSENT
Amphenol ICC	EB15, CPC12
Molex	Micro-Fit 3.0, MX150
Delphi Electronics	GT Advanced, Metri-Pack 150
JAE Electronics	DF11, MX64

7. Selection Recommendations

Key selection criteria:

1. Determine current/voltage requirements with 20% safety margin
2. Match contact pitch (2.54mm standard, 0.8mm for HDI applications)
3. Select appropriate locking mechanism (latch/screw types for vibration environments)
4. Verify material compliance (UL94 V-0 rated for flammability)
5. Assess environmental requirements (temperature, humidity, chemical exposure)
6. Evaluate termination compatibility (wire gauge range for crimp versions)

Prioritize suppliers with global footprint for volume production support.

8. Industry Trends

Key development directions:

• Miniaturization: Sub-1mm pitch solutions for mobile devices
• High-speed capability: Differential pair designs for 25+ Gbps data rates
• Eco-friendly materials: Halogen-free thermoplastics adoption
• Smart integration: Embedded sensors for condition monitoring
• Standardization: Universal designs per IEC 60603-7 series

The global market is projected to grow at 6.2% CAGR through 2027, driven by electric vehicle and 5G infrastructure demands.