1. Overview
Rectangular connectors - housings are critical components in electrical and electronic systems, serving as mechanical enclosures for contact arrays and providing alignment and protection for mating interfaces. Defined by their standardized rectangular cross-sections, these housings enable reliable signal and power transmission across diverse applications. Their importance in modern technology lies in their ability to standardize connectivity solutions while supporting miniaturization, high-speed data transfer, and harsh-environment performance in industries ranging from telecommunications to automotive systems.
2. Main Types and Functional Classification
| Type | Functional Characteristics | Application Examples |
| Single-row Housings | Compact design with one linear contact array | Consumer electronics internal connectors |
| Double-row Housings | Parallel contact arrangement for higher density | Industrial control panels and PLCs |
| High-density Housings | Miniaturized contacts with pitch 1.27mm | Telecom backplanes and server racks |
| Waterproof Housings | IP67+ rated sealing with gaskets/O-rings | Outdoor EV charging stations |
| Modular Housings | Customizable insert configurations | Multifunctional industrial equipment |
3. Structure and Components
Typical housing assemblies consist of:
- Insulating body (LCP/PBT thermoplastics) with precise contact cavities
- Integral polarization keys to prevent mis-mating
- Integrated latch mechanisms (positive/negative locks)
- Sealing interfaces (for IP-rated variants)
- PCB mounting features (through-hole/SMT terminations)
Contact retention systems use beam-type spring contacts with gold-plated phosphor bronze alloys, while environmental seals employ silicone rubber gaskets.
4. Key Technical Specifications
| Parameter | Importance |
| Rated Voltage (50-600V) | Determines dielectric strength and application safety |
| Current Rating (1-40A) | Defines power transmission capacity |
| Contact Resistance ( 10m ) | Impacts signal integrity and power loss |
| Insulation Resistance ( 10G ) | Ensures electrical isolation between circuits |
| Operating Temperature (-55 C to +150 C) | Dictates environmental suitability |
| IP Rating (IP20-IP69K) | Specifies protection against solids/liquids |
| Mechanical Life (500-10,000 cycles) | Indicates durability for frequent mating |
5. Application Fields
Primary industry applications include:
- Telecommunications: 5G base stations, optical network terminals
- Industrial Automation: PLC I/O interfaces, sensor/actuator connections
- Automotive: EV battery management systems, ADAS connectors
- Medical Equipment: Diagnostic imaging device interfaces
- Consumer Electronics: Laptop power/data hybrid connectors
Case Study: TE Connectivity's AMPMODU series enables modular connectivity in factory automation systems, supporting rapid replacement of sensors and valves without rewiring.
6. Leading Manufacturers and Products
| Manufacturer | Representative Product Series |
| TE Connectivity | AMPMODU, CONSENT |
| Amphenol ICC | EB15, CPC12 |
| Molex | Micro-Fit 3.0, MX150 |
| Delphi Electronics | GT Advanced, Metri-Pack 150 |
| JAE Electronics | DF11, MX64 |
7. Selection Recommendations
Key selection criteria:
- Determine current/voltage requirements with 20% safety margin
- Match contact pitch (2.54mm standard, 0.8mm for HDI applications)
- Select appropriate locking mechanism (latch/screw types for vibration environments)
- Verify material compliance (UL94 V-0 rated for flammability)
- Assess environmental requirements (temperature, humidity, chemical exposure)
- Evaluate termination compatibility (wire gauge range for crimp versions)
Prioritize suppliers with global footprint for volume production support.
8. Industry Trends
Key development directions:
- Miniaturization: Sub-1mm pitch solutions for mobile devices
- High-speed capability: Differential pair designs for 25+ Gbps data rates
- Eco-friendly materials: Halogen-free thermoplastics adoption
- Smart integration: Embedded sensors for condition monitoring
- Standardization: Universal designs per IEC 60603-7 series
The global market is projected to grow at 6.2% CAGR through 2027, driven by electric vehicle and 5G infrastructure demands.