Rectangular Connectors - Headers, Specialty Pin

Image	Part Number	Description / PDF	Quantity	Rfq
	160-80-318-00-001101 Preci-Dip	CONN HDR DIP SLOT 18POS TIN	0
	334-10-116-00-050000 Mill-Max	CONN HDR POST 16POS GOLD	0
	334-10-111-00-020000 Mill-Max	CONN HDR POST 11POS GOLD	0
	07-0600-21 Aries Electronics, Inc.	CONN HDR DIP POST 7POS GOLD	0
	334-90-113-00-000000 Mill-Max	CONN HDR POST 13POS TIN-LEAD	0
	150-80-628-00-106161 Preci-Dip	CONN HDR DIP MALE PIN 28POS TIN	0
	14-675-191T Aries Electronics, Inc.	CONN HDR MALE PIN 14POS TIN	0
	150-80-648-00-001101 Preci-Dip	CONN HDR DIP MALE PIN 48POS TIN	0
	334-40-155-00-050000 Mill-Max	CONN HDR POST 55POS TIN	0
	151-10-316-00-004000 Mill-Max	CONN HDR DIP POST 16POS GOLD	0
	383-10-155-00-001101 Preci-Dip	CONN HDR STRIP SOLDER 55POS GOLD	0
	334-40-150-00-000000 Mill-Max	CONN HDR POST 50POS TIN	0
	1109241 Aries Electronics, Inc.	CONN HDR DIP FORK 10POS GOLD	0
	150-10-642-00-106000 Mill-Max	CONN HDR DIP POST 42POS GOLD	0
	370-10-136-00-001101 Preci-Dip	CONN HDR STRIP TURRET 36POS GOLD	0
	380-80-136-00-001101 Preci-Dip	CONN HDR STRIP SOLDER 36POS TIN	0
	363-10-149-00-001101 Preci-Dip	CONN HDR STRIP SLOT 49POS GOLD	0
	04-3625-21 Aries Electronics, Inc.	CONN HDR DIP POST 4POS GOLD	0
	134-10-310-00-000000 Mill-Max	CONN HDR DIP POST 10POS GOLD	0
	334-40-140-00-000000 Mill-Max	CONN HDR POST 40POS TIN	0

Rectangular Connectors - Headers, Specialty Pin

1. Overview

Rectangular connectors with specialty pin headers are modular electrical components designed to establish reliable interconnections between PCBs (Printed Circuit Boards) or electronic subsystems. Their standardized rectangular housing and customizable pin configurations enable efficient signal/power transmission in compact spaces. These connectors are critical for modern electronics manufacturing, offering scalable solutions for industrial automation, telecommunications, and automotive systems where space optimization and high-density integration are paramount.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Single-Row Headers	Linear pin arrangement, 2.54mm pitch standard	Arduino shields, sensor modules
Double-Row Headers	Dual parallel pin arrays, higher contact density	Industrial control panels, test equipment
High-Density Headers	Sub-1.27mm pitch, ZIF (Zero Insertion Force) variants	Smartphones, medical imaging devices
Waterproof Headers	IP67-rated sealed designs with rubber gaskets	Outdoor LED displays, marine electronics
High-Speed Headers	Controlled impedance (50-100 ), low crosstalk design	5G base stations, PCIe interfaces
Surface-Mount Headers	Reflow-compatible solder tails for SMT assembly	Automotive ECUs, aerospace PCBs

3. Structural Composition

Standard construction includes:

Housing: LCP (Liquid Crystal Polymer) or PBT thermoplastic with UL94 V-0 flammability rating
Contact Pins: Phosphor bronze or beryllium copper alloys with Au/Ni plating (30 " gold min)
Polarization Features: Keying slots and asymmetrical pin layouts prevent misalignment
Retention Mechanism: Integral locking tabs with 0.5N-2.0N normal force specification
Termination: Through-hole or SMD (Surface Mount Device) configurations with 0.8mm-3.2mm solder tail lengths

4. Key Technical Specifications

Parameter	Typical Range	Engineering Importance
Current Rating	1-5A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Impacts signal integrity and thermal performance
Dielectric Strength	500VAC-1500VAC	Ensures electrical isolation safety
Operating Temperature	-55 C to +125 C	Defines environmental reliability limits
Insertion Force	30-150gf per pin	Affects mating durability and assembly ease
Material Flammability	UL94 V-0 rated	Compliance with safety standards
Shielding Effectiveness	60-100dB (for filtered variants)	EMI/RFI mitigation capability

5. Application Domains

Major implementation fields include:

Consumer Electronics: Smartphone camera modules, SSD storage interfaces
Industrial Automation: PLC (Programmable Logic Controller) backplanes
Automotive Systems: ADAS sensor harnesses, battery management interfaces
Telecommunications: 100Gbps optical transceiver modules
Medical Devices: Diagnostic imaging equipment probe connectors

6. Industry Leading Manufacturers

Manufacturer	Product Series	Technical Highlights
TE Connectivity	MicroSpeed Headers	0.8mm pitch, 10Gbps signal rate capability
Molex	PicoBlade+ Connectors	1.25mm pitch, 3A current rating
Amphenol	SV Series Headers	High-voltage insulation up to 1000VAC
Samtec	QSE High-Speed Arrays	25+ Gbps per differential pair performance
JST	XH Series	2.54mm pitch, 3000+ mating cycles durability

7. Selection Guidelines

Key evaluation criteria:

Current carrying requirements vs. contact cross-sectional area
Pitch selection matching PCB trace/space constraints
Environmental factors (temperature, vibration, chemical exposure)
Termination method compatibility with assembly processes
EMI shielding needs in high-frequency applications
Long-term durability requirements (mating cycle specifications)

8. Industry Development Trends

Current technology evolution directions:

Miniaturization: 0.4mm pitch connectors entering mass production (Asteelflash 2023 report)
High-Speed Integration: Differential pair designs supporting 56Gbps PAM4 signaling
Smart Manufacturing: Embedded sensors in connector housings for predictive maintenance
Material Innovation: Graphene-enhanced polymer composites reducing insertion forces by 40%
Environmental Compliance: Halogen-free LCP materials achieving 94V-0 ratings
3D Printing: Custom-shaped connectors with integrated strain relief features