Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
66951-033LF Storage & Server IO (Amphenol ICC)	CONN RCPT 33POS 0.1 GOLD PCB	0
76341-302LF Storage & Server IO (Amphenol ICC)	CONN RCPT 2POS 0.1 GOLD PCB	146
87606-318LF Storage & Server IO (Amphenol ICC)	CONN RCPT 36POS 0.1 GOLD PCB	458
75915-412LF Storage & Server IO (Amphenol ICC)	CONN RCPT 12POS 0.1 TIN PCB	387
87024-610 Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.05 GOLD SMD	0
55510-104TRLF Storage & Server IO (Amphenol ICC)	CONN RCPT 4POS 0.079 GOLD SMD	3594
55510-120TRLF Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.079 GOLD SMD	1000
71609-315LF Storage & Server IO (Amphenol ICC)	CONN RCPT 30POS 0.1 GOLD SMD R/A	180
66951-026LF Storage & Server IO (Amphenol ICC)	CONN RCPT 26POS 0.1 GOLD PCB	453
10135177-02111LF Storage & Server IO (Amphenol ICC)	CONN RCPT 2POS 0.059 TIN SMD	493
75915-405LF Storage & Server IO (Amphenol ICC)	CONN RCPT 5POS 0.1 TIN PCB	1098
89898-313LF Storage & Server IO (Amphenol ICC)	CONN RCPT 26POS 0.1 GOLD SMD	227
95290-305ALF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD SMD	10
66925-565LF Storage & Server IO (Amphenol ICC)	CONN RCPT 130P 0.1 GOLD PCB R/A	0
71991-302HLF Storage & Server IO (Amphenol ICC)	CONN RCPT 4POS 0.1 GOLD PCB	454
63453-118LF Storage & Server IO (Amphenol ICC)	CONN RCPT 18POS 0.079 GOLD PCB	717
66951-010LF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD PCB	1069
89891-303LF Storage & Server IO (Amphenol ICC)	CONN RCPT 6POS 0.1 GOLD PCB	100
89882-408LF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.1 TIN PCB R/A	522
76341-322LF Storage & Server IO (Amphenol ICC)	CONN RCPT 22POS 0.1 GOLD PCB	215

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers