Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
87606-306LF Storage & Server IO (Amphenol ICC)	CONN RCPT 12POS 0.1 GOLD PCB	1037
66527-005LF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD PCB R/A	722
71920-302LF Storage & Server IO (Amphenol ICC)	CONN RCPT 2POS 0.1 GOLD PCB	500
95290-303ALF Storage & Server IO (Amphenol ICC)	CONN RCPT 6POS 0.1 GOLD SMD	2008
87024-610TRLF Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.05 GOLD SMD	216
89898-317LF Storage & Server IO (Amphenol ICC)	CONN RCPT 34POS 0.1 GOLD SMD	195
66956-006 Storage & Server IO (Amphenol ICC)	CONN RCPT 12POS 0.1 GOLD PCB	0
71991-808LF Storage & Server IO (Amphenol ICC)	CONN RCPT 16POS 0.1 GOLD PCB	406
76342-304LF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.1 GOLD PCB	113
89898-304LF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.1 GOLD SMD	478
75915-402LF Storage & Server IO (Amphenol ICC)	CONN RCPT 2POS 0.1 TIN PCB	490
87471-630 Storage & Server IO (Amphenol ICC)	CONN RCPT 60POS 0.05 GOLD SMD	560
71991-330LF Storage & Server IO (Amphenol ICC)	CONN RCPT 60POS 0.1 GOLD PCB	141
71991-306LF Storage & Server IO (Amphenol ICC)	CONN RCPT 12POS 0.1 GOLD PCB	182
66953-011LF Storage & Server IO (Amphenol ICC)	CONN RCPT 22POS 0.1 GOLD PCB	0
71920-307LF Storage & Server IO (Amphenol ICC)	CONN RCPT 7POS 0.1 GOLD PCB	772
89898-309ALF Storage & Server IO (Amphenol ICC)	CONN RCPT 18POS 0.1 GOLD SMD	650
55508-124LF Storage & Server IO (Amphenol ICC)	CONN RCPT 24POS 0.079 GOLD SMD	348
91618-308LF Storage & Server IO (Amphenol ICC)	CONN RCPT 16POS 0.1 GOLD SMD	464
95264-301LF Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.1 GOLD PCB	178

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers