Rectangular Connectors - Headers, Receptacles, Female Sockets

Image	Part Number	Description / PDF	Quantity	Rfq
	MDF7-3S-2.54DSA Hirose	CONN RCPT 3POS 0.1 TIN PCB	0
	A3-24DA-2SV Hirose	CONN RCPT 24POS 0.079 GOLD SMD	0
	MDF7-18S-2.54DSA(55) Hirose	CONN RCPT 18POS 0.1 TIN PCB	0
	MDF7-34D-2.54DSA(56) Hirose	CONN RCPT 34POS 0.1 GOLD PCB	0
	DF3-6S-2DSA(20) Hirose	CONN RCPT 6POS 0.079 TIN PCB	0
	DF11-18DS-2V(50) Hirose	CONN RCPT 18POS 0.079 GOLD SMD	0
	MDF7-16D-2.54DSA Hirose	CONN RCPT 16POS 0.1 TIN PCB	0
	A3D-28DA-2DSE Hirose	CONN RCPT 28POS 0.079 GOLD PCB	0
	DF3-10S-2DSA(20) Hirose	CONN RCPT 10POS 0.079 TIN PCB	0
	ST60-10P Hirose	CONN RCPT 10P 0.02 GOLD EDGE MNT	0
	MDF7-17S-2.54DSA Hirose	CONN RCPT 17POS 0.1 TIN PCB	0
	A3-4DA-2SV Hirose	CONN RCPT 4POS 0.079 GOLD SMD	0
	DF11-24DS-2V(20) Hirose	CONN RCPT 24POS 0.079 TIN SMD	0
	A3D-12DA-2DSE Hirose	CONN RCPT 12POS 0.079 GOLD PCB	0
	DF11-14DS-2DSA(01) Hirose	CONN RCPT 14POS 0.079 GOLD PCB	0
	A3C-24DA-2DSE Hirose	CONN RCPT 24POS 0.079 GOLD PCB	0
	QM20-14R-PR1(50) Hirose	CONN RCPT 14P 0.07 GOLD PNL MNT	0
	MDF7-34D-2.54DSA(64) Hirose	CONN RCPT 34POS DBL STR TH GOLD	0
	DF40C-30DS-0.4V(57) Hirose	CONNECTOR	0
	GT9-25S-2.54DSA(75) Hirose	CONN RCPT T/H STR	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers