Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
M55-6106842R Harwin	CONN RCPT 68P 0.05 GOLD SMD R/A	1184
M80-8970405 Harwin	CONN RCPT 4POS 0.079 GOLD PCB	0
G125-FV11605F2P Harwin	CONN RCPT 16POS 0.049 GOLD PCB	15
M50-3140845 Harwin	CONN RCPT 8POS 0.05 GOLD SMD	517
G125-FV10805F3-2AB2ABP Harwin	CONN F-HDR 4PWR 8SIG PCB VERT	13
M80-8970705 Harwin	CONN RCPT 7POS 0.079 GOLD PCB	98
M80-4113401 Harwin	CONN RCPT 34POS 0.079 GOLD PCB	59
M50-4301245 Harwin	CONN RCPT 24POS 0.05 GOLD SMD	0
M40-3100445R Harwin	CONN RCPT 8POS 0.039 GOLD SMD	4205
M52-5000445 Harwin	CONN RCPT 4POS 0.05 GOLD PCB	3183
G125-FV21205L0P Harwin	CONN RCPT 12POS 0.049 GOLD PCB	238
M22-6360442 Harwin	CONN RCPT 8POS 0.079 GOLD SMD	896
M20-7820642 Harwin	CONN RCPT 6POS 0.1 GOLD PCB	782
G125-FS10605F2P Harwin	CONN RCPT 6POS 0.049 GOLD SMD	30
M22-6360546 Harwin	CONN RCPT 10POS 0.079 TIN SMD	0
M20-7821242 Harwin	CONN RCPT 12POS 0.1 GOLD PCB	0
G125-FV22005L0P Harwin	CONN RCPT 20POS 0.049 GOLD PCB	11
M20-7810545 Harwin	CONN RCPT 10POS 0.1 GOLD SMD	354
M80-6812642 Harwin	CONN RCPT 26POS 0.079 GOLD SMD	39
G125-FV21005L0P Harwin	CONN RCPT 10POS 0.049 GOLD PCB	119

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers