Rectangular Connectors - Headers, Receptacles, Female Sockets

Image	Part Number	Description / PDF	Quantity	Rfq
	M80-4061005 Harwin	5+5 WAY FEMALE PC TAIL 4.5MM	0
	M80-7072705 Harwin	CONN RCPT 27POS 0.079 GOLD PCB	0
	G125-FS15005F1R Harwin	CONN RECPT VERT SMT 50POS	0
	M20-7881242 Harwin	CONN RCPT 24POS 0.1 GOLD PCB R/A	0
	M20-7850846 Harwin	CONN RCPT 16POS 0.1 TIN PCB	0
	M80-4002001 Harwin	CONN RCPT 20POS 0.079 GOLD PCB	0
	M80-4211205 Harwin	CONN FEMALE VERT 12POS	0
	M50-3101045R Harwin	CONN SOCKET 1.27MM 20POS	0
	M22-6360342 Harwin	CONN RCPT 6POS 0.079 GOLD SMD	0
	M80-6810842 Harwin	CONN RCPT 8POS 0.079 GOLD SMD	0
	G125-FV11605F1R Harwin	CONN RECPT VERT PCB 16POS	0
	M80-4023405 Harwin	CONN FEMALE VERT 34POS	0
	G125-FV11005F1R Harwin	CONN RECPT VERT PCB 10POS	0
	M20-7881042 Harwin	CONN RCPT 20POS 0.1 GOLD PCB R/A	0
	M20-7861142 Harwin	CONN RECPT 2.54MM SMT 11POS	0
	M80-4101005 Harwin	CONN FEMALE VERT 10POS	0
	M80-4202601 Harwin	CONN RCPT 26POS 0.079 GOLD PCB	0
	M80-7701845 Harwin	CONN RCPT 18POS 0.079 GOLD PCB	0
	M50-3150442R Harwin	CONN SOCKET 1.27MM 8POS	0
	M50-3100745 Harwin	CONN RCPT 14POS 0.05 GOLD SMD	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers