Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
M20-7921042R Harwin	CONN RCPT 20POS 0.1 GOLD SMD R/A	881
M52-5010845 Harwin	CONN RCPT 8POS 0.05 GOLD PCB	0
M52-5150445 Harwin	CONN RCPT 8POS 0.05 GOLD SMD	0
M20-7911042R Harwin	CONN RCPT 10POS 0.1 GOLD SMD R/A	1096
M55-6021642R Harwin	CONN RCPT 16POS 0.05 GOLD SMD	915
M22-7140542 Harwin	CONN RCPT 10POS 0.079 GOLD PCB	7203
M22-7130642 Harwin	CONN RCPT 6POS 0.079 GOLD PCB	2088
G125-FS11005F1P Harwin	CONN RCPT 10POS 0.049 GOLD SMD	0
M22-7141742 Harwin	CONN RCPT 34POS 0.079 GOLD PCB	0
M20-7880542 Harwin	CONN RCPT 10POS 0.1 GOLD PCB R/A	683
M50-4301545 Harwin	CONN RCPT 30POS 0.05 GOLD SMD	5
G125-FS12005F1P Harwin	CONN RCPT 20POS 0.049 GOLD SMD	33
M52-5100345 Harwin	CONN RCPT 6POS 0.05 GOLD PCB	0
M50-3200445 Harwin	CONN RCPT 8POS 0.05 GOLD PCB R/A	666
M22-6551042R Harwin	CONN RCPT 20P 0.079 GOLD SMD R/A	77
M50-3140345 Harwin	CONN RCPT 3POS 0.05 GOLD SMD	1734
M80-8871405 Harwin	CONN RCPT 14POS 0.079 GOLD PCB	182
M50-3110542 Harwin	CONN RCPT 10POS 0.05 GOLD SMD	496
M20-7880346 Harwin	CONN RCPT 6POS 0.1 TIN PCB R/A	2606
M50-3201545 Harwin	CONN RCPT 30P 0.05 GOLD PCB R/A	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers