Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
M80-8502645 Harwin	CONN RCPT 26POS 0.079 GOLD PCB	0
M20-7920642R Harwin	CONN RCPT 12POS 0.1 GOLD SMD R/A	200
G125-FV15005F2P Harwin	CONN RCPT 50POS 0.049 GOLD PCB	18
M50-3150842 Harwin	CONN RCPT 16POS 0.05 GOLD SMD	0
M80-8501845 Harwin	CONN RCPT 18POS 0.079 GOLD PCB	99
M50-3121245 Harwin	CONN RCPT 24POS 0.05 GOLD SMD	115
M22-6360842 Harwin	CONN RCPT 16POS 0.079 GOLD SMD	311
M80-8872605 Harwin	CONN RCPT 26POS 0.079 GOLD PCB	205
M20-7881246 Harwin	CONN RCPT 24POS 0.1 TIN PCB R/A	114
G125-FV11205L0P Harwin	CONN RCPT 12POS 0.049 GOLD PCB	167
M20-7810445R Harwin	CONN RCPT 8POS 0.1 GOLD SMD	11200
M22-6550542R Harwin	CONN RCPT 10P 0.079 GOLD SMD R/A	717
G125-FS13405L0P Harwin	CONN RCPT 34POS 0.049 GOLD SMD	215
G125-FV15005F1P Harwin	CONN RCPT 50POS 0.049 GOLD PCB	10
M80-4102642 Harwin	CONN RCPT 26POS 0.079 GOLD PCB	282
M20-7830842 Harwin	CONN RCPT 16POS 0.1 GOLD PCB	50
M20-7890542 Harwin	CONN RCPT 5POS 0.1 GOLD PCB R/A	36
M80-8501642 Harwin	CONN RCPT 16POS 0.079 GOLD PCB	10
M20-7831342 Harwin	CONN RCPT 26POS 0.1 GOLD PCB	324
G125-FV11205F3P Harwin	CONN RCPT 12POS 0.049 GOLD PCB	33

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers