Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
234201 ERNI Electronics	SMC F VERT B 80POS SMT 13.7MM	231
154805 ERNI Electronics	SMC F VERT B 12POS SMT 6.20MM	821
154717 ERNI Electronics	SMC F VERT B 12POS SMT 9.00MM	43
154720 ERNI Electronics	SMC F VERT B 68POS SMT 9.00MM	412
234198 ERNI Electronics	SMC F VERT B 12POS SMT 13.7MM	91
154807 ERNI Electronics	SMC F VERT B 50POS SMT 6.20MM	571
204763 ERNI Electronics	SMC F VERT B 26POS SMT 13.7MM	107
234199 ERNI Electronics	SMC F VERT B 50POS SMT 13.7MM	111
154741 ERNI Electronics	SMC F RA Q 26POS SMT	631
154740 ERNI Electronics	SMC F RA Q 12POS SMT	743
154742 ERNI Electronics	SMC F RA Q 50POS SMT	778
154806 ERNI Electronics	SMC F VERT B 26POS SMT 6.20MM	260
154809 ERNI Electronics	SMC F VERT B 80POS SMT 6.20MM	254
234200 ERNI Electronics	SMC F VERT B 68POS SMT 13.7MM	105
354939 ERNI Electronics	SMC F RA Q 12POS SMT LOCK	560
154808 ERNI Electronics	SMC F VERT B 68POS SMT 6.20MM	414
154718 ERNI Electronics	SMC F VERT B 26POS SMT 9.0MM	267
354063 ERNI Electronics	SMC F VERT B 20POS SMT 9MM	280

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers