Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
5025841560 Woodhead - Molex	CONN RCPT 15POS 0.059 TIN SMD	2998
0009483096 Woodhead - Molex	CONN RCPT 9POS 0.156 GOLD PCB	9
0447641601 Woodhead - Molex	CONN RCPT 16P 0.118 TIN PCB R/A	1614
0448120008 Woodhead - Molex	CONN RCPT 8POS 0.1 TIN PCB	761
0038001422 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN PCB	4179
0022182021 Woodhead - Molex	CONN RCPT 2POS 0.1 GOLD PCB	6577
5031750600 Woodhead - Molex	CONN RCPT 6POS 0.059 TIN PCB R/A	5716
0460100621 Woodhead - Molex	CONN RCPT 6POS 0.165 TIN PCB	0
0038001395 Woodhead - Molex	CONN RCPT 5POS 0.1 TIN PCB	1445
0015247067 Woodhead - Molex	CONN RCPT 6POS 0.165 GOLD PCB	0
0009484038 Woodhead - Molex	CONN RCPT 3POS 0.156 TIN PCB	0
0010844092 Woodhead - Molex	CONN HDR 9POS 0.25 TIN PCB	443
0873684424 Woodhead - Molex	CONN RCPT 44P 0.079 GOLD SMD R/A	95
0009481114 Woodhead - Molex	CONN RCPT 11P 0.156 TIN EDGE MNT	20
0022173062 Woodhead - Molex	CONN RCPT 6POS 0.1 GOLD PCB	2051
0447692001 Woodhead - Molex	CONN RCPT 20POS 0.118 TIN PCB	0
2132250210 Woodhead - Molex	CONN RECPT VERT SMC 2 POS	788
5025850470 Woodhead - Molex	CONN RCPT 4POS 0.059 TIN SMD R/A	4675
0447690603 Woodhead - Molex	CONN RCPT 6POS 0.118 GOLD PCB	0
0791077009 Woodhead - Molex	CONN RCPT 20POS 0.079 GOLD PCB	2088

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers