Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
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CONN RCPT 9POS 0.197 TIN PCB

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CONN RCPT 24POS 0.197 TIN PCB

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1440200000

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CONN RCPT 4POS 0.197 GOLD PCB

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1418300000

1418300000

Weidmuller

CONN RCPT 24POS 0.197 TIN PCB

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1417300000

1417300000

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CONN RCPT 18POS 0.197 TIN PCB

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1418200000

1418200000

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CONN RCPT 24POS 0.197 GOLD PCB

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1419700000

1419700000

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CONN RCPT 36POS 0.197 TIN PCB

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1413700000

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CONN RCPT 4POS 0.197 TIN PCB

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1418600000

1418600000

Weidmuller

CONN RCPT 24POS 0.197 GOLD PCB

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1414200000

1414200000

Weidmuller

CONN RCPT 6POS 0.197 GOLD PCB

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1417200000

1417200000

Weidmuller

CONN RCPT 18POS 0.197 GOLD PCB

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1414600000

1414600000

Weidmuller

CONN RCPT 6POS 0.197 GOLD PCB

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1440300000

1440300000

Weidmuller

CONN RCPT 4POS 0.197 TIN PCB

0

1415200000

1415200000

Weidmuller

CONN RCPT 9POS 0.197 GOLD PCB

0

1413300000

1413300000

Weidmuller

CONN RCPT 4POS 0.197 TIN PCB

0

1413200000

1413200000

Weidmuller

CONN RCPT 4POS 0.197 GOLD PCB

0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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